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參數(shù)資料
| 型號(hào)： | MC14599BCP |
| 廠商： | MOTOROLA INC |
| 元件分類(lèi)： | 通用總線功能 |
| 英文描述： | Battery-Backup Supervisor for Low Power Processors 14-TSSOP -40 to 85 |
| 中文描述： | 4000/14000/40000 SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, PDIP18 |
| 封裝： | PLASTIC, DIP-18 |
| 文件頁(yè)數(shù)： | 8/9頁(yè) |
| 文件大?。?/td> | 287K |
| 代理商： | MC14599BCP |
MOTOROLA CMOS LOGIC DATA
253
MC14099B MC14599B
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1
8
16
9
SPLANE
F
J
M
R
X 45
G
8 PL
P
–B–
–A–
M
0.25 (0.010)
B
S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010)
A
S
T
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
9.80
3.80
1.35
0.35
0.40
1.27 BSC
0.19
0.10
0
5.80
0.25
MAX
10.00
4.00
1.75
0.49
1.25
MIN
0.386
0.150
0.054
0.014
0.016
0.050 BSC
0.008
0.004
0
0.229
0.010
MAX
0.393
0.157
0.068
0.019
0.049
INCHES
MILLIMETERS
0.25
0.25
7
6.20
0.50
0.009
0.009
7
0.244
0.019
L SUFFIX
CERAMIC DIP PACKAGE
CASE 726–04
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F FOR FULL LEADS. HALF
LEADS OPTIONAL AT LEAD POSITIONS 1, 9,
10, AND 18.
1
SEATING
PLANE
10
9
18
M
K
C
N
F
G
D
L
–A–
–B–
18 PL
0.25 (0.010)
J
18 PL
0.25 (0.010)
–T–
S
A
M
T
S
B
M
T
CONFIOPTIONAL LEAD
DIM
A
B
C
D
F
MIN
0.880
0.240
–––
0.015
0.055
MAX
0.910
0.295
0.200
0.021
0.070
MIN
22.35
6.10
–––
0.38
1.40
MAX
23.11
7.49
5.08
0.53
1.78
MILLIMETERS
INCHES
G
J
K
L
M
N
2.54 BSC
0.20
3.18
7.62 BSC
0
0.51
0.100 BSC
0.008
0.125
0.300 BSC
0
0.020
0.30
4.32
0.012
0.170
15
1.02
15
0.040
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