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參數(shù)資料
| 型號： | MC33143 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | DUAL HIGH–SIDE SWITCH(雙高端開關(guān)) |
| 中文描述： | 雙高邊開關(guān)（雙高端開關(guān)） |
| 文件頁數(shù)： | 2/8頁 |
| 文件大小： | 279K |
| 代理商： | MC33143 |
MC33143
2
MOTOROLA ANALOG IC DEVICE DATA
Figure 1. Simplified Internal Block Diagram
NOTE:
Pins 5, 6, 7, 8, 17, 18, 19 and 20 should all be grounded so as to provide electrical as well as thermal heatsinking of the device.
Overvoltage
Shutdown
Voltage
Regulator
OFF/ON
Open Load
Detect
Gate
Control
Bias
OFF/ON
Open Load
Detect
4.0 ms
Retry Timer
Fault Detection
ON/OFF Open Load
ON/OFF VPwr Short
On Ground Short
Over Temperature
VPwr Overvoltage
Current
Limit
Over
Temperature
Shutdown
Fault Detection
ON/OFF Open Load
ON/OFF VPwr Short
On Ground Short
Over Temperature
VPwr Overvoltage
Gate
Control
Current
Limit
Over
Temperature
Shutdown
VPwr (9, 16)
SFPD (14)
IN1 (1)
VDD (11)
GTST (15)
CEN (2)
IN2 (12)
Gnd (5) (See Note)
OUT1 (24)
STAT1 (3)
INT (23)
OUT2 (13)
STAT2 (10)
–10 V
–10 V
15 V
55 V
55 V
15 V
Charge
Pump
MAXIMUM RATINGS
(All voltages are with respect to ground, unless otherwise noted.)
Rating
Symbol
Value
Unit
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Positive Load Dump Transient (Note 2)
Power Supply Voltage
Steady State Continuous Operation
60
V
26
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Logic Supply Voltage Range
–0.3 to 7.0
V
Logic Supply Current
Input Voltage (Note 3)
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Output Clamp Voltage
5.0
–0.3 to 7.0
–3.0 to –20
mA
V
V
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TJ = 25
°
C
TJ = 125
°
C
ESD (Minimum)
Human Body Model (Note 5)
Machine Model (Note 6)
Power Dissipation (TA = 25
°
C) (Note 7)
Operating Temperature (Note 8)
300
100
V
HBM
MM
2000
200
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Junction–to–Lead
Junction–to–Ambient
R
θ
JL
R
θ
JA
PD
TA
TJ
Tstg
Tsolder
15
30
4.2
W
Operating Junction Temperature
–40 to +125
°
C
–40 to +150
°
C
áááááááááááááááááááááá
Storage Temperature
–55 to +150
°
C
Soldering Temperature (for 10 Seconds)
270
°
C
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Thermal Resistance
°
C/W
NOTES:
1.Negative transient survival capability
for 100 ms time duration.
2.Positive transient survival capability
with typical automotive load dump
condition; 400 ms time constant
decay.
3.All input pins (IN1–2, CEN and
SFPD).
4.Each output has independent
current limiting.
5.Performed in accordance to HBM;
CZap = 100 pF, RZap = 1500
.
6.Performed in accordance to MM;
CZap = 100 pF, RZap = 0
.
7.Derate Power Dissipation 33 mW/
°
C
for temperatures above 25
°
C.
8.Ambient temperature is given as a
practical reference; Maximum
junction temperature is the limiting
factor.
9.ESD data available upon request.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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