參數資料
型號: MC33164D-3
廠商: MOTOROLA INC
元件分類: 電源管理
英文描述: MICROPOWER UNDERVOLTAGE SENSING CIRCUITS
中文描述: 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8
封裝: PLASTIC, SOIC-8
文件頁數: 2/8頁
文件大小: 150K
代理商: MC33164D-3
MC34164 MC33164
2
MOTOROLA ANALOG IC DEVICE DATA
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Input Supply Voltage
Vin
VO
ISink
–1.0 to 12
V
Reset Output Voltage
–1.0 to 12
V
Reset Output Sink Current
Internally
Limited
mA
Clamp Diode Forward Current, Pin 1 to 2 (Note 1)
IF
100
mA
Power Dissipation and Thermal Characteristics
P Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25
°
C
Thermal Resistance, Junction–to–Air
D Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25
°
C
Thermal Resistance, Junction–to–Air
DM Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25
°
C
Thermal Resistance, Junction–to–Air
PD
R
θ
JA
PD
R
θ
JA
PD
R
θ
JA
TJ
TA
700
178
700
178
520
240
mW
°
C/W
mW
°
C/W
mW
°
C/W
Operating Junction Temperature
+150
°
C
Operating Ambient Temperature Range
MC34164 Series
MC33164 Series
0 to +70
– 40 to + 85
°
C
Storage Temperature Range
Tstg
– 65 to +150
°
C
NOTE:
ESD data available upon request.
MC34164–3, MC33164–3 SERIES
ELECTRICAL CHARACTERISTICS
(For typical values TA = 25
°
C, for min/max values TA is the operating ambient temperature range
that applies [Notes 2 & 3], unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
COMPARATOR
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis (ISink = 100
μ
A)
VIH
VIL
VH
2.55
2.55
0.03
2.71
2.65
0.06
2.80
2.80
V
RESET OUTPUT
Output Sink Saturation
(Vin = 2.4 V, ISink = 1.0 mA)
(Vin = 1.0 V, ISink = 0.25 mA)
VOL
0.14
0.1
0.4
0.3
V
Output Sink Current (Vin, Reset = 2.4 V)
Output Off–State Leakage
(Vin, Reset = 3.0 V)
(Vin, Reset = 10 V)
ISink
IR(leak)
6.0
12
30
mA
0.02
0.02
0.5
1.0
μ
A
Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 5.0 mA)
VF
6.0
0.9
1.2
V
TOTAL DEVICE
Operating Input Voltage Range
Vin
Iin
1.0 to 10
V
Quiescent Input Current
Vin = 3.0 V
Vin = 6.0 V
9.0
24
15
40
μ
A
NOTES:
1.Maximum package power dissipation limits must be observed.
2.Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
3.Tlow= 0
°
C for MC34164
3.Tlow=
– 40
°
C for MC33164
Thigh= + 70
°
C for MC34164
Thigh
= + 85
°
C for MC33164
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