參數(shù)資料
型號(hào): MC33172VDG
廠商: ON Semiconductor
文件頁(yè)數(shù): 6/15頁(yè)
文件大?。?/td> 0K
描述: IC OPAMP DUAL LOW POWER 8-SOIC
標(biāo)準(zhǔn)包裝: 98
放大器類(lèi)型: 通用
電路數(shù): 2
轉(zhuǎn)換速率: 2.1 V/µs
增益帶寬積: 1.8MHz
電流 - 輸入偏壓: 20nA
電壓 - 輸入偏移: 2000µV
電流 - 電源: 220µA
電流 - 輸出 / 通道: 27mA
電壓 - 電源,單路/雙路(±): 3 V ~ 44 V,±1.5 V ~ 22 V
工作溫度: -40°C ~ 125°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOICN
包裝: 管件
其它名稱(chēng): MC33172VDG-ND
MC33172VDGOS
MC33171, 2, 4, NCV33172, 4
http://onsemi.com
14
PACKAGE DIMENSIONS
SOIC14
CASE 751A03
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
A
B
G
P 7 PL
14
8
7
1
M
0.25 (0.010)
B M
S
B
M
0.25 (0.010)
A S
T
T
F
R X 45
SEATING
PLANE
D 14 PL
K
C
J
M
_
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
8.55
8.75
0.337
0.344
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.054
0.068
D
0.35
0.49
0.014
0.019
F
0.40
1.25
0.016
0.049
G
1.27 BSC
0.050 BSC
J
0.19
0.25
0.008
0.009
K
0.10
0.25
0.004
0.009
M
0
7
0
7
P
5.80
6.20
0.228
0.244
R
0.25
0.50
0.010
0.019
__
7.04
14X
0.58
14X
1.52
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
7X
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
相關(guān)PDF資料
PDF描述
TSW-103-24-S-S CONN HEADER 3POS .100" SNGL
TSW-103-07-F-D CONN HEADER 6POS .100" DBL
TSW-149-05-G-D CONN HEADER 98POS .100" DL GOLD
TSW-101-25-S-D-RA CONN HEADER 2POS .100" DBL R/A
HTSW-101-26-S-D CONN HEADER 2POS 2.54MM T/H
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