參數(shù)資料
型號(hào)： MC33389
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： System Basis Chip with Low Speed Fault Tolerant CAN(帶低速容錯(cuò)CAN接口的系統(tǒng)基片)
中文描述： 系統(tǒng)基礎(chǔ)芯片與低速容錯(cuò)CAN（帶低速容錯(cuò)的CAN接口的系統(tǒng)基片）
文件頁數(shù)： 10/35頁
文件大?。?/td> 591K
代理商： MC33389
MC33389
10
MC33389
Thermal Management
The MC33389 is proposed in two different packages.
HSOP20 for high power applications and SO28WB with 8 pins
to the leadframe for medium power applications.
HSOP20 Package
For such a package, the heat flow is mainly vertical and
each heat source (dissipating element) can be seen as an
independent thermal resistance to the Heatsink. The thermal
network can be roughly depicted as:
Figure 2. HSOP20 Simplified Thermal Model
Example
Assuming I
V1
=100mA at V
bat
=16V,
I
V2
=150mA at V
bat
=16V (Excluding CAN consumption).
I
CAN
=50mA at V
bat
=16V, we have :
P
V1
=1.1W, P
V2
=1.65W, P
can
=0.55W
System assumptions:
If T
amb
=85°C and R
thc/a
=18°C/W, this gives:
T
case
=T
amb
+R
th c/a
x 3.3W = 85+18 x 3.3=145°C
and T
j
V1=T
j
V2=T
jcan
=155°C.
This example represents the limit for the maximum power
dissipations with a HSOP20.
T
ambient
T
case
(heatsink)
V1 power
V2 power
Can power
T
j
(max 155°C)
R
thj/c
=18°C/W
6.5°C/W
9°C/W
R
thc/a
(ECU supplier dependent)
SO28WB Package
The case(pin) to junction R
th
is here represented by only
one thermal resistance for the total power since the 3 power
sources strongly interact on the silicon for such a package.
Figure 3. SO28WB Simplified Thermal Model
Example
Assuming I
V1
=45mA at V
bat
=16V,
I
V2
=45mA at V
bat
=16V (Excluding CAN consumption).
I
CAN
=50mA at V
bat
=16V, we have :
P
V1
=0.5W, P
V2
=0.5W, P
can
=0.55W thus P
total
=1.55W
System assumptions:
If T
amb
=85°C and R
thc/a
=25°C/W, this gives:
T
case
=T
amb
+R
thc/a
x 1.55W=85+25x1.55 =124°C
and T
j
V1=124 + 20 x 1.55= 155°C.
This example represents the limit for the maximum power
dissipations with a SO28WB.
T
case
(pin)
T
j
(max 155°C)
Total power
R
thc/a
T
ambient
R
thj/c
=20°C/W
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
相關(guān)PDF資料
PDF描述
MC33390 J-1850 SERIAL TRANSCEIVER(串行J-1850總線收發(fā)器)
MC33394 Switch Mode Power Supply with Multiple Linear Regulators and High Speed CAN Transceiver(帶有多個(gè)線性穩(wěn)壓器和高速CAN收發(fā)器的開關(guān)方式電源)
MC33395 Three-Phase Gate Driver IC(3相柵極驅(qū)動(dòng)器)
MC33397 Dual/Hex Low-Side Switch with Both SPI and Parallel Input Control(帶SPI和并口輸入控制的2或6低端開關(guān))
MC33399 “Local Interconnect Network” Physical Interface(“本地互聯(lián)網(wǎng)”（LIN）物理接口)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC33389CDH 功能描述:IC SYSTEM BASIS W/CAN 20-HSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A
MC33389CDHR2 功能描述:IC SYSTEM BASE W/CAN 20-HSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A
MC33389CDW 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SYSTEM BASIC CHIPS RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
MC33389CDWR2 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SYSTEM BASIC CHIPS RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
MC33389DDW 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SBC SOW28 RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*