參數(shù)資料
型號: MC33661
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: LIN Enhanced Physical Interface(LIN網(wǎng)增強(qiáng)型物理接口)
中文描述: 林增強(qiáng)型物理接口(林網(wǎng)增強(qiáng)型物理接口)
文件頁數(shù): 1/20頁
文件大?。?/td> 377K
代理商: MC33661
RXD
33661
MCU
TXD
EN
WAKE
LIN
GND
INH
V
SUP
LIN Bus
V
PWR
12.0 V / 5.0 V
Regulator
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
Motorola, Inc. 2004
Document order number: MC33661
Rev 3.0, 10/2004
33661
Advance Information
LIN Enhanced Physical Interface
Local Interconnect Network (LIN) is a serial communication protocol
designed to support automotive networks in conjunction with Controller Area
Network (CAN). As the lowest level of a hierarchical network, LIN enables
cost-effective communication with sensors and actuators when all the features
of CAN are not required.
The 33661 is a Physical Layer component dedicated to automotive LIN sub-
bus applications. It offers slew rate selection for optimized operation at
10 kbps and 20 kbps, fast baud rate (above 100 kbps) for test and
programming modes
,
excellent radiated emission performance, and safe
behavior in the event of LIN bus short-to-ground or LIN bus leakage during
low-power mode.
Features
Operational from V
SUP
6.0 V to 18 V DC, Functional up to 27 V DC, and
Handles 40 V During Load Dump
Active Bus Waveshaping Offering Excellent Radiated Emission
Performance
5.0 kV ESD on LIN Bus Terminal
30 k
Internal Pullup Resistor
LIN Bus Short-to-Ground or High Leakage in Sleep Mode
-18 V to +40 V DC Voltage at LIN Terminal
8.0
μ
A Standby Current in Sleep Mode
Local and Remote Wake-Up Capability Reported by INH and RXD
Terminals
5.0 V and 3.3 V Compatible Digital Inputs Without Any External
Components Required
LIN INTERFACE
ORDERING INFORMATION
Device
Temperature
Range (T
A
)
Package
MC33661D/R2
-40°C to 125°C
8 SOICN
D SUFFIX
CASE 751-06
8-TERMINAL SOICN
33661 Simplified Application Diagram
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
相關(guān)PDF資料
PDF描述
MC33689 System Basis Chip with LIN transceiver(帶LIN收發(fā)器的系統(tǒng)基片)
MC33701 1.5 A Switch-Mode Power Supply with Linear Regulator(1.5 A開關(guān)方式電源,帶線性穩(wěn)壓器)
MC33702 3.0 A Switch-Mode Power Supply with Linear Regulator(3.0 A開關(guān)方式電源,帶線性穩(wěn)壓器)
MC33742 System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver(帶增強(qiáng)型高速CAN收發(fā)器的系統(tǒng)基片)
MC33790 Two-Channel Distributed System Interface (DSI) Physical Interface Device(2通道分布式系統(tǒng)接口(DSI)物理接口)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC33661PEF 功能描述:LIN 收發(fā)器 ENHANCED LIN INTERFACE RoHS:否 制造商:NXP Semiconductors 工作電源電壓: 電源電流: 最大工作溫度: 封裝 / 箱體:SO-8
MC33661PEFR2 功能描述:LIN 收發(fā)器 ENHANCED LIN INTERFACE RoHS:否 制造商:NXP Semiconductors 工作電源電壓: 電源電流: 最大工作溫度: 封裝 / 箱體:SO-8
MC33662BLEF 功能描述:IC TXRX LIN 2.1 10KBPS 8SOIC 制造商:nxp usa inc. 系列:- 包裝:管件 零件狀態(tài):在售 類型:收發(fā)器 協(xié)議:LIN 驅(qū)動器/接收器數(shù):1/1 雙工:- 數(shù)據(jù)速率:20kbps 電壓 - 電源:7 V ~ 18 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商器件封裝:8-SOIC 標(biāo)準(zhǔn)包裝:98
MC33662JEF 功能描述:LIN 收發(fā)器 LINcell RoHS:否 制造商:NXP Semiconductors 工作電源電壓: 電源電流: 最大工作溫度: 封裝 / 箱體:SO-8
MC33662JEFR2 功能描述:LIN 收發(fā)器 LINcell RoHS:否 制造商:NXP Semiconductors 工作電源電壓: 電源電流: 最大工作溫度: 封裝 / 箱體:SO-8