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參數(shù)資料
| 型號(hào)： | MC33794 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國(guó))有限公司 |
| 英文描述： | Electric Field Imaging Device(電場(chǎng)成像設(shè)備) |
| 中文描述： | 電場(chǎng)成像設(shè)備（電場(chǎng)成像設(shè)備） |
| 文件頁數(shù)： | 9/20頁 |
| 文件大?。?/td> | 742K |
| 代理商： | MC33794 |
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33794
9
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Peak V
PWR
Voltage
V
PWRPK
40
V
Double Battery
1 Minute Maximum T
A
= 30
°
C
V
DBLBAT
26.5
V
ESD Voltage
Human Body Model (Note 1)
Machine Model (Note 2)
V
ESD1
V
ESD2
±2000
±200
V
Storage Temperature
T
STG
-55 to 150
°
C
Operating Ambient Temperature
T
A
-40 to 85
°
C
Operating Junction Temperature
T
J
-40 to 150
°
C
Thermal Resistance
Junction-to-Ambient (Note 3)
Junction-to-Case (Note 4)
Junction-to-Board (Note 5)
R
θ
J-A
R
θ
J-C
R
θ
J-B
41
0.2
3.0
°
C/W
Lead Soldering Temperature (for 10 Seconds)
T
SOLDER
260
°
C
Notes
1.
2.
3.
ESD1 performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
).
ESD2 performed in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
).
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with SEMI G38-
87 and JEDEC JESD51-2 with the single layer board horizontal.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MILSPEC 883
Method 1012.1) with the cold plate temperature used for the case temperature.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
4.
5.
F
Freescale Semiconductor, Inc.
Go to: www.freescale.com
n
.
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