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參數(shù)資料
| 型號： | MC33887 |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 英文描述： | 5.0 A H-Bridge with Load Current Feedback(帶本地電流反饋功能的5.0A H橋接器) |
| 中文描述： | 5.0的H -橋的負載電流反饋（帶本地電流反饋功能的5.0AH橋接器） |
| 文件頁數(shù)： | 7/28頁 |
| 文件大?。?/td> | 760K |
| 代理商： | MC33887 |
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MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33887
7
THERMAL RESISTANCE (AND PACKAGE DISSIPATION) RATINGS
(Note 9), (Note 10), (Note 11), (Note 12)
Junction-to-Board (Bottom)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JB
~5.0
~4.3
~8.0
°
C/W
Junction-to-Ambient, Natural Convection, Single-Layer Board (1s)
(Note 13)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JA
~41
~TBD
~62
°
C/W
Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p)
(Note 14)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JMA
~30
~21.3
~TBD
°
C/W
Junction-to-Case (Top) (Note 15)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JC
~0.5
~0.9
~1.5
°
C/W
Notes
9.
10.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
Exposed heatsink pad plus the power and ground terminals comprise the main heat conduction paths. The actual R
θ
JB
(junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace thickness.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1) with the cold plate temperature used for the case temperature.
11.
12.
13.
14.
15.
MAXIMUM RATINGS (continued)
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
F
Freescale Semiconductor, Inc.
Go to: www.freescale.com
n
.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC33887APVW | 功能描述:馬達/運動/點火控制器和驅(qū)動器 H-BRIDGE W/LD CURNT FDBK RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube |
| MC33887APVW-PB | 制造商:Freescale Semiconductor 功能描述: |
| MC33887APVWR2 | 功能描述:馬達/運動/點火控制器和驅(qū)動器 H-BRIDGE W/LD CURNT FDBK RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube |
| MC33887AVW | 功能描述:開關(guān) IC - 各種 H-BRIDGE W/LD CURNT FDBK RoHS:否 制造商:Fairchild Semiconductor 開啟電阻（最大值）: 電源電壓-最大:4.4 V 電源電壓-最小:2.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:WLCSP-9 封裝:Reel |
| MC33887AVWR2 | 功能描述:馬達/運動/點火控制器和驅(qū)動器 H-BRIDGE W/LD CURNT FDBK RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube |
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