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參數(shù)資料
| 型號： | MC33997 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | Switching Power Supply with Linear Regulators(帶線性穩(wěn)壓器的開關(guān)電源) |
| 中文描述： | 開關(guān)電源與線性穩(wěn)壓器（帶線性穩(wěn)壓器的開關(guān)電源） |
| 文件頁數(shù)： | 5/20頁 |
| 文件大?。?/td> | 454K |
| 代理商： | MC33997 |
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33997
5
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Main Supply Voltage
V
PWR
-0.3 to 45
V
Keep-Alive Supply Voltage
KA_V
PWR
-0.3 to 45
V
Switching Node
V
SW
-0.5 to 45
V
5.0 V Input Power
V
DDH
-0.3 to 6.0
V
Sensor Supply
V
REF1
V
REF2
-0.3 to 18
-0.3 to 18
V
Keep-Alive Supply Voltage
V
KAM
-0.3 to 6.0
V
Maximum Voltage at Logic I/O Pins
EN
SNSEN
PWROK
VKAMOK
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
V
Charge Pump Reservoir Capacitor Voltage
C
RES
-0.3 to 18
V
Error Amplifier Summing Node
V
SUM
-0.3 to 6.0
V
Switching Regulator Output Feedback
FBKB
-0.3 to 6.0
V
V
DDL
Base Drive
DRVL
-0.3 to 6.0
V
V
DDL
Feedback
FBL
-0.3 to 6.0
V
ESD Voltage
Human Body Model (all pins) (Note 1)
Machine Model (all pins) (Note 2)
V
ESD1
V
ESD2
±500
±100
V
Power Dissipation (T
A
= 25
°
C) (Note 3)
P
D
800
mW
Thermal Resistance, Junction to Ambient (Note 4), (Note 5)
R
θ
J-A
60
°C/W
Thermal Resistance, Junction to Board (Note 6)
R
θ
J-B
20
°C/W
Operational Package Temperature [Ambient Temperature] (Note 7)
T
A
-40 to 125
°C
Operational Junction Temperature
T
J
-40 to 150
°C
Storage Temperature
T
STG
-55 to 150
°C
Lead Soldering Temperature (Note 8)
T
S
260
°C
Notes
1.
2.
3.
4.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
=100 pF, R
ZAP
=1500
).
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
=200 pF, R
ZAP
=0
)
Maximum power dissipation at indicated junction temperature.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
Lead soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5.
6.
7.
8.
F
Freescale Semiconductor, Inc.
Go to: www.freescale.com
n
.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC33997DW | 功能描述:IC SWITCH 3.3/5V SUPPLY 24-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 專用型 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,000 系列:- 應(yīng)用:電源，ICERA E400，E450 輸入電壓:4.1 V ~ 5.5 V 輸出數(shù):10 輸出電壓:可編程 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:42-WFBGA，WLCSP 供應(yīng)商設(shè)備封裝:42-WLP 包裝:帶卷 (TR) |
| MC33997DWR2 | 制造商:Rochester Electronics LLC 功能描述:MLPS 3.3 IC - Bulk |
| MC33999EK | 功能描述:多路器開關(guān) IC 16 LOW SIDE PWM&SPI RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關(guān)數(shù)量:4 開啟電阻（最大值）:7 Ohms 開啟時間（最大值）: 關(guān)閉時間（最大值）: 傳播延遲時間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16 |
| MC33999EK | 制造商:Freescale Semiconductor 功能描述:IC SWITCH 16 OUT SPI/PWM 54SOIC |
| MC33999EKR2 | 功能描述:多路器開關(guān) IC 16 LOW SIDE PWM&SPI RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關(guān)數(shù)量:4 開啟電阻（最大值）:7 Ohms 開啟時間（最大值）: 關(guān)閉時間（最大值）: 傳播延遲時間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16 |
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