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參數(shù)資料
| 型號： | MC34940EGR2 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 6/12頁 |
| 文件大小： | 0K |
| 描述： | IC IMAGING DEVICE ELEC 24-SOICW |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 類型： | 圖像傳感器 |
| 輸入類型： | 邏輯 |
| 輸出類型： | 電壓 |
| 電流 - 電源： | 8mA |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-SOIC W |
| 包裝： | 帶卷 (TR) |
| 配用： | DEMO1985MC34940E-ND - KIT DEMO FOR MC34940E FAMILY |
Sensors
Freescale Semiconductor
3
MC34940
Table 1. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Peak VPWR Voltage
VPWRPK
40
V
Double Battery
1 Minute Maximum TA = 30°C
VDBLBAT
26.5
V
ESD Voltage
Human Body Model (CZAP = 100 pF, RZAP = 1500 )
Machine Model (CZAP = 200 pF, RZAP = 0 )
Charge Device Model (CDM), Robotic (CZAP = 4.0 pF)
VESD
±2000
±200
±1200
V
THERMAL RATINGS
Storage Temperature
TSTG
-55 to 150
°C
Operating Ambient Temperature
TA
-0 to 90
°C
Operating Junction Temperature
TJ
-0 to 150
°C
Thermal Resistance
Junction-to-Ambient (1)
Junction-to-Case (2)
Junction-to-Board (3)
RθJA
RθJC
RθJB
41
0.2
3.0
°C/W
Soldering Temperature (4)
TSOLDER
260
°C
Notes
1.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with
SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
2.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MILSPEC 883 Method 1012.1) with the cold plate temperature used for the case temperature.
3.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
4.
Terminal soldering temperature limit is for 10 seconds maximum duration. The device is not designed for immersion soldering.
Exceeding these limits may cause malfunction or permanent damage to the device.
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