參數(shù)資料
型號(hào)： MC7457TRX1000NC
廠商： Freescale Semiconductor
文件頁數(shù)： 58/71頁
文件大小： 0K
描述： IC MPU RISC 32BIT 483FCCBGA
標(biāo)準(zhǔn)包裝： 36
系列： MPC74xx
處理器類型： 32-位 MPC74xx PowerPC
速度： 1.0GHz
電壓： 1.1V
安裝類型： 表面貼裝
封裝/外殼： 483-BCBGA，F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝： 483-FCCBGA（29x29）
包裝： 托盤
System Design Information
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
61
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
9.8.1
Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 5, the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case (actually top-of-die since silicon die is exposed) thermal resistance
The die junction-to-ball thermal resistance
Figure 28 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 28. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink attach
material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Because the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the
silicon may be neglected. Thus, the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
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參數(shù)描述
MC7457TRX1267LC 制造商:Freescale Semiconductor 功能描述:MPC74XX RISC 32-BIT 0.13UM 1.267GHZ 1.5V/1.8V/2.5V 483-PIN F - Trays
MC7457VG1000LC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC7457VG1000NC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.1V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC7457VG1267LC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC7457VG733NC 功能描述:IC MPU RISC 733MHZ 483FCCBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤
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