參數(shù)資料
型號(hào): MC74HC1G00DTT1G
廠商: ON Semiconductor
文件頁數(shù): 6/6頁
文件大?。?/td> 0K
描述: IC GATE NAND SGL 2INPUT 5TSOP
標(biāo)準(zhǔn)包裝: 1
系列: 74HC
邏輯類型: 與非門
電路數(shù): 1
輸入數(shù): 2
電源電壓: 2 V ~ 6 V
電流 - 靜態(tài)(最大值): 1µA
輸出電流高,低: 2.6mA,2.6mA
邏輯電平 - 低: 0.5 V ~ 1.8 V
邏輯電平 - 高: 1.5 V ~ 4.2 V
額定電壓和最大 CL 時(shí)的最大傳播延遲: 17ns @ 6V,50pF
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 5-TSOP
封裝/外殼: 6-TSOP(0.059",1.50mm 寬)5 引線
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁面: 1123 (CN2011-ZH PDF)
其它名稱: MC74HC1G00DTT1GOSDKR
MC74HC1G00
http://onsemi.com
6
PACKAGE DIMENSIONS
TSOP5
CASE 48302
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM
MIN
MAX
MILLIMETERS
A
3.00 BSC
B
1.50 BSC
C
0.90
1.10
D
0.25
0.50
G
0.95 BSC
H
0.01
0.10
J
0.10
0.26
K
0.20
0.60
M
0
10
S
2.50
3.00
12
3
54
S
A
G
B
D
H
C
J
__
0.7
0.028
1.0
0.039
mm
inches
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
C AB
T
0.10
2X
T
0.20
NOTE 5
C SEATING
PLANE
0.05
K
M
DETAIL Z
TOP VIEW
SIDE VIEW
A
B
END VIEW
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