參數(shù)資料
型號(hào): MC74HC74AFEL
廠商: ON Semiconductor
文件頁(yè)數(shù): 6/9頁(yè)
文件大?。?/td> 0K
描述: IC FLIP FLOP DUAL D S/R 14SOEIAJ
產(chǎn)品變化通告: Product Obsolescence 24/Jan/2011
標(biāo)準(zhǔn)包裝: 2,000
系列: 74HC
功能: 設(shè)置(預(yù)設(shè))和復(fù)位
類型: D 型
輸出類型: 差分
元件數(shù): 2
每個(gè)元件的位元數(shù): 1
頻率 - 時(shí)鐘: 35MHz
延遲時(shí)間 - 傳輸: 17ns
觸發(fā)器類型: 正邊沿
輸出電流高,低: 5.2mA,5.2mA
電源電壓: 2 V ~ 6 V
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-SOIC(0.209",5.30mm 寬)
包裝: 帶卷 (TR)
MC74HC74A
http://onsemi.com
6
PACKAGE DIMENSIONS
PDIP14
CASE 64606
ISSUE R
17
14
8
b2
NOTE 8
D
A
TOP VIEW
E1
B
b
L
A1
A
C
SEATING
PLANE
0.010
CA
SIDE VIEW
M
14X
D1
e
A2
NOTE 3
M
B M
eB
E
END VIEW
WITH LEADS CONSTRAINED
DIM
MIN
MAX
INCHES
A
0.210
A1
0.015
b
0.014
0.022
C
0.008
0.014
D
0.735
0.775
D1
0.005
e
0.100 BSC
E
0.300
0.325
M
10
5.33
0.38
0.35
0.56
0.20
0.36
18.67
19.69
0.13
2.54 BSC
7.62
8.26
10
MIN
MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1
0.240
0.280
6.10
7.11
b2
eB
0.430
10.92
0.060 TYP
1.52 TYP
c
A2
0.115
0.195
2.92
4.95
L
0.115
0.150
2.92
3.81
°
H
NOTE 5
NOTE 6
M
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MC74HC74AF IC FLIP FLOP DUAL D S/R 14SOEIAJ
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