參數(shù)資料
型號(hào)： MC8641HX1333KC
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： MICROPROCESSOR, CBGA1023
封裝： 33 X 33 MM, CERAMIC, BGA-1023
文件頁數(shù)： 21/140頁
文件大?。?/td> 1484K
代理商： MC8641HX1333KC
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 0
Freescale Semiconductor
117
Thermal
Figure 60 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 60. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink attach
material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Because the silicon thermal resistance is quite small, the temperature drop in the silicon may be neglected
for a first-order analysis. Thus the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.
19.2.2
Thermal Interface Materials
A thermal interface material is recommended at the package-to-heat sink interface to minimize the thermal
contact resistance. Figure 61 shows the thermal performance of three thin-sheet thermal-interface
materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function
of contact pressure. As shown, the performance of these thermal interface materials improves with
increasing contact pressure. The use of thermal grease significantly reduces the interface thermal
resistance. That is, the bare joint results in a thermal resistance approximately seven times greater than the
thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board
(see Figure 59). Therefore, synthetic grease offers the best thermal performance, considering the low
interface pressure, and is recommended due to the high power dissipation of the MPC8641. Of course, the
selection of any thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, and so on.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
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