參數(shù)資料
型號(hào)： MC9S08AC96CFGE
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 6/40頁(yè)
文件大小： 0K
描述： MCU 96K FLASH 8K RAM 44-LQFP
標(biāo)準(zhǔn)包裝： 160
系列： S08
核心處理器： S08
芯體尺寸： 8-位
速度： 40MHz
連通性： I²C，LIN，SCI，SPI
外圍設(shè)備： LVD，POR，PWM，WDT
輸入/輸出數(shù)： 38
程序存儲(chǔ)器容量： 96KB（96K x 8）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 6K x 8
電壓 - 電源 (Vcc/Vdd)： 2.7 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x10b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 44-LQFP
包裝： 托盤
Chapter 3 Electrical Characteristics and Timing Specifications
MC9S08AC128 Series Data Sheet, Rev. 4
14
Freescale Semiconductor
Solving equations 1 and 2 for K gives:
K = PD (TA + 273C) + JA (PD)
2
Eqn. 3-3
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations 1 and 2 iteratively for any
value of TA.
3.5
ESD Protection and Latch-Up Immunity
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits,
normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure
that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage.
All ESD testing is in conformity with AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits and
JEDEC Standard for Non-Automotive Grade Integrated Circuits. During the device qualification ESD stresses were performed
for the Human Body Model (HBM), the Machine Model (MM) and the Charge Device Model (CDM).
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device specification. Complete
DC parametric and functional testing is performed per the applicable device specification at room temperature followed by hot
temperature, unless specified otherwise in the device specification.
3.6
DC Characteristics
This section includes information about power supply requirements, I/O pin characteristics, and power supply current in various
operating modes.
Table 3-4. ESD and Latch-up Test Conditions
Model
Description
Symbol
Value
Unit
Human Body
Series Resistance
R1
1500
Storage Capacitance
C
100
pF
Number of Pulse per pin
–
3
Machine
Series Resistance
R1
0
Storage Capacitance
C
200
pF
Number of Pulse per pin
–
3
Latch-up
Minimum input voltage limit
– 2.5
V
Maximum input voltage limit
7.5
V
Table 3-5. ESD and Latch-Up Protection Characteristics
Num C
Rating
Symbol
Min
Max
Unit
1
C Human Body Model (HBM)
VHBM
2000
–
V
2
C Machine Model (MM)
VMM
200
–
V
3
C Charge Device Model (CDM)
VCDM
500
–
V
4C Latch-up Current at TA = 125CILAT
100
–
mA
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC9S08AC96CFGER 制造商:Freescale Semiconductor 功能描述:96K FLASH, 8K RAM - Tape and Reel
MC9S08AC96CFUE 功能描述:8位微控制器 -MCU 8 Bit 96K FLASH 8K RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
MC9S08AC96CLKE 功能描述:8位微控制器 -MCU 8 Bit 96K FLASH 8K RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
MC9S08AC96MFGE 功能描述:8位微控制器 -MCU 96K FLASH, 8K RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
MC9S08AC96MFUE 功能描述:8位微控制器 -MCU 96K FLASH, 8K RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
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