Appendix A Electrical Characteristics
MC9S08DN60 Series Data Sheet, Rev 2
308
Freescale Semiconductor
This device contains circuitry protecting against damage due to high static voltage or electrical elds;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for instance, either VSS or VDD).
A.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or
VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
loads), the difference between pin voltage and VSS or VDD will be very small.
Table A-2. Absolute Maximum Ratings
Num
Rating
Symbol
Value
Unit
1
Supply voltage
VDD
–0.3 to + 5.8
V
2
Input voltage
VIn
– 0.3 to VDD + 0.3
V
3
Instantaneous maximum current
Single pin limit
(applies to all port pins)1, 2, 3
1 Input must be current limited to the value specied. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp
voltages, then use the larger of the two resistance values.
2 All functional non-supply pins are internally clamped to V
SS and VDD.
3 Power supply must maintain regulation within operating V
DD range during instantaneous and operating
maximum current conditions. If positive injection current (VIn > VDD) is greater than IDD, the injection
current may ow out of VDD and could result in external power supply going out of regulation. Ensure
external VDD load will shunt current greater than maximum injection current. This will be the greatest
risk when the MCU is not consuming power. Examples are: if no system clock is present, or if the clock
rate is very low which would reduce overall power consumption.
ID
± 25
mA
4
Maximum current into VDD
IDD
120
mA
5
Storage temperature
Tstg
–55 to +150
°C