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Appendix A Electrical Characteristics
MC9S08EL32 Series and MC9S08SL16 Series Data Sheet, Rev. 3
332
Freescale Semiconductor
A.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take PI/O into account in power calculations, determine the difference between actual pin
voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high
pin current (heavy loads), the difference between pin voltage and VSS or VDD is very small.
Table A-2. Absolute Maximum Ratings
Rating
Symbol
Value
Unit
Supply voltage
VDD
–0.3 to +5.8
V
Maximum current into VDD
IDD
120
mA
Digital input voltage
VIn
–0.3 to VDD +0.3
V
Instantaneous maximum current
Single pin limit (applies to all port pins)1, 2, 3
1
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp
voltages, then use the larger of the two resistance values.
2 All functional non-supply pins are internally clamped to V
SS and VDD.
3 Power supply must maintain regulation within operating V
DD range during instantaneous and
operating maximum current conditions. If positive injection current (VIn > VDD) is greater than
IDD, the injection current may flow out of VDD and could result in external power supply going
out of regulation. Ensure external VDD load shunts current greater than maximum injection
current. This is the greatest risk when the MCU is not consuming power. For example, if no
system clock is present, or if the clock rate is very low (which would reduce overall power
consumption).
ID
± 25
mA
Storage temperature range
Tstg
–55 to 150
°C
Table A-3. Thermal Characteristics
Num
C
Rating
Symbol
Value
Unit
1—
Operating temperature range (packaged)
Temperature Code M
TA
–40 to 125
°C
Temperature Code V
–40 to 105
Temperature Code C
–40 to 85
2D
Thermal resistance1,2 Single-layer board
20-pin TSSOP
θ
JA
113
°C/W
28-pin TSSOP
91
3D
Thermal resistance1,2 Four-layer board
20-pin TSSOP
θ
JA
73
°C/W
28-pin TSSOP
58
4
D
Maximum junction temperature
TJ
135
°C