參數(shù)資料
型號(hào): MC9S08LL16CLH
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 8-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP64
封裝: ROHS COMPLIANT, LQFP-64
文件頁數(shù): 3/44頁
文件大小: 951K
代理商: MC9S08LL16CLH
Electrical Characteristics
MC9S08LL16 Series MCU Data Sheet, Rev. 6
Freescale Semiconductor
11
3.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take PI/O into account in power calculations, determine the difference between actual pin
voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high
pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in C can be obtained from:
TJ = TA + (PD JA)
Eqn. 3-1
where:
TA = Ambient temperature, C
JA = Package thermal resistance, junction-to-ambient, C/W
PD = Pint PI/O
Pint = IDD VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O Pint and can be neglected. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
PD = K (TJ + 273C)
Eqn. 3-2
Solving Equation 3-1 and Equation 3-2 for K gives:
K = PD (TA + 273C) + JA (PD)
2
Eqn. 3-3
Table 5. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range
(packaged)
TA
TL to TH
–40 to 85
C
Maximum junction temperature
TJM
95
C
Thermal resistance
Single-layer board
64-pin LQFP
JA
72
C/W
48-pin QFN
84
48-pin LQFP
81
Thermal resistance
Four-layer board
64-pin LQFP
JA
54
C/W
48-pin QFN
30
48-pin LQFP
57
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