Ordering Information and Mechanical Drawings
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
220
Freescale Semiconductor
B.2
Mechanical Drawings
The following pages are mechanical drawings for these packages:
28-Pin PDIP
28-Pin SOIC
32-Pin LQFP
44-Pin LQFP
48-Pin QFN
See
Table B-1 for package availability for each MC9S08RC/RD/RE/RG device.
Table B-2. Package Descriptions
Pin Count
Type
Abbreviation
Designator
Document No.
28
Plastic Dual In-Line Package
PDIP
P
98ASB42390B
28
Small Outline Integrated Circuit
SOIC
DW
98ASB42345B
32
Low Quad Flat Package
LQFP
FJ
98ASH70029A
44
Low Quad Flat Package
LQFP
FG
98ASB42885B
48
Quad Flat Package
QFN
FD
98ARH99048A
MC 9 S08 RG60 (C) XX E
Family
Memory
Status
Core
Type
Package designator
Indicates Pb-free packaging
Temperature range
designator
C = –40 thru 85
°C
Blank = 0 thru 70
°C