參數(shù)資料
型號(hào)： MC9S08SV8CLC
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 8-BIT, FLASH, 40 MHz, MICROCONTROLLER, QFP32
封裝： 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITRCH, ROHS COMPLIANT, MS-026BBA, LQFP-32
文件頁(yè)數(shù)： 2/40頁(yè)
文件大小： 749K
代理商： MC9S08SV8CLC
MC9S08SV16 Series Data Sheet, Rev. 2
Electrical Characteristics
Freescale Semiconductor
10
5.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take PI/O into account in power calculations, determine the difference between actual pin
voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high
pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. 1
Table 3. Absolute Maximum Ratings
Rating
Symbol
Value
Unit
Supply voltage
VDD
–0.3 to 5.8
V
Maximum current into VDD
IDD
120
mA
Digital input voltage
VIn
–0.3 to VDD +0.3
V
Instantaneous maximum current
Single pin limit (applies to all port pins)1, 2, 3
1
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp
voltages, then use the larger of the two resistance values.
2 All functional non-supply pins, except for PTA5 are internally clamped to V
SS and VDD.
3 Power supply must maintain regulation within operating V
DD range during instantaneous and
operating maximum current conditions. If positive injection current (VIn > VDD) is greater than
IDD, the injection current may flow out of VDD and could result in external power supply going
out of regulation. Ensure external VDD load will shunt current greater than maximum injection
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low (which would reduce overall power
consumption).
ID
±25
mA
Storage temperature range
Tstg
–55 to 150
°C
Table 4. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range
(packaged)
TA
TL to TH
–40 to 85
°C
Thermal resistance
Single-layer board
32-pin SDIP
θ
JA
60
°C/W
32-pin LQFP
85
Thermal resistance
Four-layer board
32-pin LQFP
θ
JA
35
°C/W
32-pin LQFP
56
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