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參數(shù)資料
| 型號(hào)： | MCCF33095 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 模擬信號(hào)調(diào)理 |
| 英文描述： | INTEGRAL ALTERNATOR REGULATOR |
| 中文描述： | SPECIALTY ANALOG CIRCUIT, UUC10 |
| 封裝： | FCP-10 |
| 文件頁(yè)數(shù)： | 10/12頁(yè) |
| 文件大?。?/td> | 165K |
| 代理商： | MCCF33095 |
MCCF33095 MC33095
10
MOTOROLA ANALOG IC DEVICE DATA
Shear strength testing should meet a 0.8 Newtons/Bump
criteria. Shear strength testing should follow thermocycling of
the chip from – 40
°
to +140
°
C to insure the stability of shear
strength over temperature. Figure 13 depicts a test set–up
which might possibly be used.
Figure 13. Shear Test Fixture
Flip–Chip
Cantilever Arm
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éé
éé
éé
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Substrate
Aside from physical contamination, flip–chips, like any
other chips, should not be handled directly due to the fact that
electrostatic discharges can cause permanent damage to the
electronic circuit. Flip–chips which do survive an electrostatic
discharge can be left in a weakened condition resulting in
reduced reliability of the end product. To avoid electrostatic
damage of the circuit, assembly personnel should make use
of a wrist strap or some other device to provide electrostatic
grounding of their body. For the same reason, machinery
used to assemble semiconductor circuits should be
electrostaticly grounded.
Flip–chips rely primarily on the thermal path established by
the bumps to remove heat from the chip as a result of internal
circuit operation. Standard Motorola flip–chips have a thermal
resistance of approximately 290
°
C/W/Bump. This figure can
be used to estimate the allowed maximum power dissipation
of the chip.
Cost and Equipment Manufacturers
The cost of implementing a flip–chip assembly process
depends on the specific production requirements and as a
result will vary over a broad range. It is possible to implement
a small volume laboratory set–up for a few hundred dollars
using manual operations. At the other end of the scale one
could spend millions setting up a fully automated line
incorporating pattern recognization, chip and substrate
orientation, reflow, cleaning, and test. The module fabricator
will have to make this assessment.
An assembly operator can manually accomplish the pick
and place operation using a vacuum probe to pick–up and
orient the flip–chip onto the substrate. Furthermore, it is
possible to perform the reflow assembly operation using a
simple batch process oven fabricated from a laboratory hot
plate. However, the use of such process techniques will have
questionable impact on the final product’s reliability and
quality. For this reason, it is highly recommended that the
module fabricator seriously consider two major pieces of
equipment; a pick and place machine and an infrared solder
reflow oven. Both pieces of equipment can vary over a wide
cost range depending on the production requirements. A
partial list of manufacturers for this equipment is given below.
Pick and Place Machine:
Universal Instruments Corp.
Dover Technologies, Inc.
Binghamton, NY 13902
(607) 772–7522
Seiko
Torrance, CA 90505
(310) 517–7850
Laurier Inc.
Hudson, NH 03051
(603) 889–8800
Infrared Reflow Oven:
BTU
Bellerica, MA 01862
(508) 667–4111
Vitronics
Newmarket, NH 03857
(603) 659–6550
Additional Applications
Completed ceramic flip–chip sub–assemblies can be
stacked one on top of another to produce an overall
assembly by making contact connections through bumps.
This technology is beginning to emerge in the computer
industry where physical module size is of significant
importance. Furthermore, this assembly technology, though
more complex, is undergoing serious consideration within the
automotive industry as well.
Applications requiring small size and high reliability at high
ambient temperatures can benefit considerably through the
implementation of flip–chip assembly techniques.
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