參數(shù)資料
型號: MCM63P818ZP133R
廠商: MOTOROLA INC
元件分類: DRAM
英文描述: HOOD DB9 PLASTIC 10 PACK
中文描述: 256K X 18 CACHE SRAM, 4 ns, PBGA119
封裝: PLASTIC, BGA-119
文件頁數(shù): 25/27頁
文件大小: 328K
代理商: MCM63P818ZP133R
MCM63P636
25
MOTOROLA FAST SRAM
MCM
63P636
XX
XXX
X
Motorola Memory Prefix
Part Number
Full Part Numbers — MCM63P636TQ200
MCM63P636TQ200R
MCM63P636ZP200R
MCM63P636ZP225R
MCM63P636ZP250R
MCM63P636ZP200
MCM63P636ZP225
MCM63P636ZP250
Package (TQ = TQFP, ZP = PBGA)
Blank = Trays, R = Tape and Reel
Speed (250 = 250 MHz, 225 = 225 MHz,
200 = 200 MHz)
ORDERING INFORMATION
(Order by Full Part Number)
ZP PACKAGE
9 x 17 BUMP PBGA
CASE 1107–01
0.20 (0.008)
DIM
A
B
C
D
E
F
G
K
N
P
R
S
MIN
14.00 BSC
22.00 BSC
–––
0.60
0.50
1.30
1.27 BSC
0.80
11.90
19.40
10.16 BSC
20.32 BSC
MAX
MIN
0.551 BSC
0.866 BSC
–––
0.024
0.020
0.051
0.050 BSC
0.031
0.469
0.764
0.400 BSC
0.800 BSC
MAX
INCHES
MILLIMETERS
2.40
0.90
0.70
1.70
0.094
0.035
0.028
0.067
1.00
12.10
19.60
0.039
0.476
0.772
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
–W–
B
R
A
S
G
–L–
P
N
TOP VIEW
D
0.30 (0.012)
0.10 (0.004)
C
BOTTOM VIEW
0.15 (0.006)
T
0.25 (0.010)
T
4X
S
W
S
L
S
T
T
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1 2 3 4 5 6 7 8
S
153X
16X
G
8X
9
F
K
E
–T–
SIDE VIEW
0.035 (0.014) T
PACKAGE DIMENSIONS
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