MCM64E918
MCM64E836
24
MOTOROLA FAST SRAM
RS PACKAGE
153–BUMP FLIPPED CHIP CBGA
CASE 1107B–01
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
153X
BOTTOM VIEW
D
0.2
7
6
5
4
3
2
1
b
0.15
A
E
E2
D2
C
B
e
0.3
A B C
PIN A1
INDEX
4X
TOP VIEW
16X
M
M
e
8X
E1
D1
3
A
PLANE
SIDE VIEW
A1
A2
A3
A4
0.15 A
0.35 A
0.25 A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M1992.
2. ALL DIMENSIONS IN MILLIMETERS.
3. DIMENSION b IS THE MAXIMUMSOLDER BALL
DIAMETER MEASURED PARALLEL TO DATUM
PLANE A.
4. DATUMA, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5. D2 AND E2 DEFINE THE AREA OCCUPIED BY
THE DIE. D3 IS THE MINIMUMCLEARANCE FROM
THE PACKAGE EDGE TO THE CHIP CAPACITORS.
6. CAPACITORS MAY NOT BE PRESENT ON ALL
DEVICES.
7. CAUTION MUST BE TAKEN NOT TO SHORT
EXPOSED METAL CAPACITOR PADS ON
PACKAGE TOP.
DIM
A
A1
A2
A3
A4
D
D1
D2
E
E1
E2
b
e
MIN
–––
0.80
1.70
0.80
0.90
22.00 BSC
20.32 BSC
11.60
14.00 BSC
7.62 BSC
6.80
0.82
1.27 BSC
MAX
3.02
1.00
2.02
0.92
1.10
MILLIMETERS
11.90
6.11
0.93
A
153X
9
8
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