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參數(shù)資料
| 型號： | MCM64PC32T |
| 廠商： | Motorola, Inc. |
| 英文描述： | 256K/512K Pipelined BurstRAM Secondary Cache Module for Pentium |
| 中文描述： | 256K/512K流水線BurstRAM二級高速緩存模塊奔騰 |
| 文件頁數(shù)： | 6/16頁 |
| 文件大小： | 167K |
| 代理商： | MCM64PC32T |
MCM64PC32T
MCM64PC64T
6
MOTOROLA FAST SRAM
SYNCHRONOUS TRUTH TABLE
(See Notes 1, 2, and 3)
CCS
ADSP
CADS
CADV
CWEx
CLK0
Address Used
Operation
H
X
L
X
X
L–H
N/A
Deselected
L
L
X
X
X
L–H
External Address
Read Cycle, Begin Burst
L
H
L
X
L
L–H
External Address
Write Cycle, Begin Burst
L
H
L
X
H
L–H
External Address
Read Cycle, Begin Burst
X
H
H
L
L
L–H
Next Address
Write Cycle, Continue Burst
X
H
H
L
H
L–H
Next Address
Read Cycle, Continue Burst
X
H
H
H
L
L–H
Current Address
Write Cycle, Suspend Burst
X
H
H
H
H
L–H
Current Address
Read Cycle, Suspend Burst
H
X
H
L
L
L–H
Next Address
Write Cycle, Continue Burst
H
X
H
L
H
L–H
Next Address
Read Cycle, Continue Burst
H
X
H
H
L
L–H
Current Address
Write Cycle, Suspend Burst
H
X
H
H
H
L–H
Current Address
Read Cycle, Suspend Burst
NOTES:
1. X means Don’t Care.
2. All inputs except CG must meet setup and hold times for the low–to–high transition of clock (CLK0/1).
3. Wait states are inserted by suspending burst.
ASYNCHRONOUS TRUTH TABLE
(See Notes 1 and 2)
Operation
CG
I/O Status
Read
L
Data Out
Read
H
High–Z
Write
X
High–Z — Data In
Deselected
X
High–Z
NOTES:
1. X means Don’t Care.
2. For a write operation following a read operation, G must be high before the input data
required setup time and held high through the input data hold time.
DC ABSOLUTE MAXIMUM RATINGS
(Voltages Referenced to VSS = 0 V)
Rating
Symbol
Value
Unit
Power Supply Voltage
VDD3
– 0.5 to + 4.6
V
Voltage Relative to VSS
Vin, Vout
VSS – 0.5 to VDD3 + 0.5
V
Output Current (per I/O)
Iout
±
20
mA
Temperature Under Bias
Tbias
– 10 to + 85
°
C
Operating Temperature
TJ
20 to +110
°
C
Storage Temperature
Tstg
– 55 to + 125
°
C
NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for
extended periods of time could affect device reliability.
This device contains circuitry to protect the
inputs against damage due to high static volt-
ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi-
mum rated voltages to this high–impedance
circuit.
This BiCMOS memory circuit has been
designed to meet the dc and ac specifications
shown in the tables, after thermal equilibrium
has been established.
This device contains circuitry that will
ensure the output devices are in High–Z at
power up.
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