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參數(shù)資料
| 型號(hào)： | MCP1259T-EUN |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | Regulated 3.3V, Low-Ripple Charge Pump with Low- Operating Current SLEEP Mode or BYPASS Mode |
| 中文描述： | 3.3V的穩(wěn)壓，低紋波充電泵具有低工作電流睡眠模式或旁路模式 |
| 文件頁(yè)數(shù)： | 16/24頁(yè) |
| 文件大?。?/td> | 1183K |
| 代理商： | MCP1259T-EUN |
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MCP1256/7/8/9
DS21989A-page 16
2006 Microchip Technology Inc.
10-Lead Plastic Dual-Flat No-Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated
E2
D
A1
A
A3
TOP VIEW
EXPOSED
METAL
PAD
BOTTOM VIEW
2
1
ID INDEX
AREA
(
NOTE 1
)
PIN 1
E
L
D2
p
b
n
TIE BAR
(
NOTE 3
)
EXPOSED
(
NOTE 2
)
K
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
INCHES
NOM
.020 BSC
.008 REF.
3.
Package may have one or more exposed tie bars at ends.
1.
Pin 1 visual index feature may vary, but must be located within the hatched area.
2.
Exposed pad varies according to die attach paddle size.
JEDEC equivalent: Not Registered
Drawing No. C04-063
*
Controlling Parameter
§
Significant Characteristic
Revised 09-12-05
Standoff
Lead Thickness
Overall Length
Number of Pins
Pitch
Overall Height
Contact Length §
Contact-to-Exposed Pad §
Lead Width
Exposed Pad Width
Exposed Pad Length
Overall Width
Notes:
Dimension Limits
(
Note 3
)
(
Note 3
)
L
K
D2
b
E
E2
D
A1
A3
.051
.008
.012
.008
.000
.112
.082
.112
MIN
Units
e
A
n
.031
.065
.010
.016
.001
.118
.094
.118
.067
.015
.020
.002
.124
.096
.124
MAX
.035
10
.039
0.20 REF.
0.30
0.20
0.18
1.30
0.00
2.08
2.85
2.85
0.40
0.25
1.65
0.02
3.00
2.39
3.00
0.50 BSC
MILLIMETERS
*
NOM
0.80
MIN
10
0.90
0.50
0.30
1.70
0.05
2.45
3.15
3.15
1.00
MAX
—
—
—
—
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