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參數(shù)資料
| 型號： | MCP1630 |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | High-Speed, Microcontroller-Adaptable, Pulse Width Modulator |
| 中文描述： | 高速微控制器適應(yīng)性，脈寬調(diào)制器 |
| 文件頁數(shù)： | 14/18頁 |
| 文件大?。?/td> | 273K |
| 代理商： | MCP1630 |
MCP1630
DS21896A-page 14
2004 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
D
A
A1
L
c
(F)
α
A2
E1
E
p
B
n
1
2
φ
β
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
.037 REF
F
φ
Footprint (Reference)
Foot Angle
Lead Thickness
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Lead Width
β
α
c
B
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Number of Pins
Pitch
A
A2
L
E1
D
A1
E
.016
.024
.118 BSC
.118 BSC
.000
.030
.193 TYP.
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
-
-
.009
.016
15°
0.08
0.22
0°
0.23
0.40
15°
15°
8°
MILLIMETERS*
NOM
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.037
.006
.031
0.40
0.00
0.75
MIN
MAX
1.10
0.95
0.80
0.15
MAX
8
-
-
-
5°
5°
JEDEC Equivalent: MO-187
0°
-
8°
5°
5°
-
-
15°
-
-
-
-
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