t
參數(shù)資料
型號: MCP2050T-330E/MQ
廠商: Microchip Technology
文件頁數(shù): 19/42頁
文件大?。?/td> 0K
描述: IC TXRX LIN 3.3V LDO 20-QFN
產(chǎn)品培訓模塊: Microchip MCP20xx LIN Transceiver Overview
標準包裝: 3,300
系列: *
MCP2050
DS22299B-page 26
2012 Microchip Technology Inc.
2.5
Thermal Specifications
Voltage Regulator
Bus Activity Debounce time
tBDB
30
80
250
s
Bus Activity to Voltage
Regulator Enabled
tBACTIVE
35
200
s
Voltage Regulator Enabled
to Ready
tVEVR
300
1200
s
Chip Select to Ready Mode
tCSR
——
230
s
Chip Select to Power-down
tCSPD
300
s
Short circuit to shut-down
tSHUTDOWN
20
100
s
RESET Timing
VREG OK detect to RESET
inactive
tRPU
——
60.0
s
VREG not OK detect to
RESET active
tRPD
——
60.0
s
Note 1:
Time depends on external capacitance and load. Test condition: CREG = 4.7uF, no resistor load.
2:
For design guidance only, not tested.
THERMAL CHARACTERISTICS
Parameter
Symbol
Typ
Max
Units
Test Conditions
Recovery Temperature
RECOVERY
+140
C
Shutdown Temperature
SHUTDOWN
+150
C
Short Circuit Recovery Time
tTHERM
1.5
5.0
ms
Thermal Package Resistances
Thermal Resistance, 14L-PDIP
JA
70
C/W
Thermal Resistance, 14L-SOIC
JA
95.3
C/W
Thermal Resistance, 20L-QFN
JA
36.1
C/W
Note 1:
The maximum power dissipation is a function of TJMAX,
JA and ambient temperature TA. The maximum
allowable power dissipation at an ambient temperature is PD = (TJMAX - TA)
JA. If this dissipation is
exceeded, the die temperature will rise above 150
C and the MCP2050 will go into thermal shutdown.
2.4
AC Specification (Continued)
AC CHARACTERISTICS
VBB = 6.0V to 18.0V; TA = -40°C to +125°C
Parameter
Sym.
Min.
Typ.
Max.
Units
Test Conditions
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