參數(shù)資料
型號(hào): MCP23016-I/ML
廠商: Microchip Technology
文件頁(yè)數(shù): 25/38頁(yè)
文件大?。?/td> 0K
描述: IC I/O EXPANDER I2C 16B 28QFN
標(biāo)準(zhǔn)包裝: 61
接口: I²C
輸入/輸出數(shù): 16
中斷輸出:
頻率 - 時(shí)鐘: 400kHz
電源電壓: 2 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 28-VQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 28-QFN(6x6)
包裝: 管件
包括: POR
產(chǎn)品目錄頁(yè)面: 684 (CN2011-ZH PDF)
2007 Microchip Technology Inc.
DS20090C-page 31
MCP23016
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
28
Pitch
e
0.65 BSC
Overall Height
A
0.80
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Width
E
6.00 BSC
Exposed Pad Width
E2
3.65
3.70
4.20
Overall Length
D
6.00 BSC
Exposed Pad Length
D2
3.65
3.70
4.20
Contact Width
b
0.23
0.30
0.35
Contact Length
L
0.50
0.55
0.70
Contact-to-Exposed Pad
K
0.20
D
EXPOSED
D2
e
b
K
E2
E
L
N
NOTE 1
1
2
1
N
A
A1
A3
TOP VIEW
BOTTOM VIEW
PAD
Microchip Technology Drawing C04-105B
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