參數(shù)資料
型號(hào): MCP23016T-I/ML
廠商: Microchip Technology
文件頁(yè)數(shù): 11/38頁(yè)
文件大小: 0K
描述: IC I/O EXPANDER I2C 16B 28QFN
標(biāo)準(zhǔn)包裝: 1,600
接口: I²C
輸入/輸出數(shù): 16
中斷輸出:
頻率 - 時(shí)鐘: 400kHz
電源電壓: 2 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 28-VQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 28-QFN(6x6)
包裝: 帶卷 (TR)
包括: POR
2007 Microchip Technology Inc.
DS20090C-page 19
MCP23016
2.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Ambient temperature under bias................................................................................................................ -55 to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS ......................................................................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +6.5V
Total power dissipation (Note 1) ............................................................................................................................ 1.0 W
Maximum current out of VSS pin .......................................................................................................................... 300 mA
Maximum current into VDD pin ............................................................................................................................. 250 mA
Input clamp current, IIK (VI < 0, or VI > VDD) .......................................................................................................
± 20 mA
Output clamp current, IOK (VO < 0, or VO > VDD) ................................................................................................
± 20 mA
Maximum output current sunk by any I/O pin......................................................................................................... 25 mA
Maximum output current sourced by any I/O pin ................................................................................................... 25 mA
Maximum current sunk by combined PORTS ...................................................................................................... 200 mA
Maximum current sourced by combined PORTS ................................................................................................ 200 mA
Note 1: Power dissipation is calculated as follows:
Pdis = VDD x {IDD -
∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOl x IOL)
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
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