參數(shù)資料
型號: MCP23S09-E/SO
廠商: Microchip Technology
文件頁數(shù): 42/50頁
文件大?。?/td> 0K
描述: IC I/O EXPANDER SPI 8B 18SOIC
標(biāo)準(zhǔn)包裝: 42
接口: SPI
輸入/輸出數(shù): 8
中斷輸出:
頻率 - 時鐘: 10MHz
電源電壓: 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 18-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 18-SOIC
包裝: 管件
產(chǎn)品目錄頁面: 684 (CN2011-ZH PDF)
2009 Microchip Technology Inc.
DS22121B-page 47
MCP23009/MCP23S09
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
.
Device
MCP23009:
8-Bit I/O Expander w/ I2C Interface
MCP23009T:
8-Bit I/O Expander w/ I2C Interface
(Tape and Reel)
MCP23S09:
8-Bit I/O Expander w/ SPI Interface
MCP23S09T:
8-Bit I/O Expander w/ SPI Interface
(Tape and Reel)
Temperature
Range
E= -40
°C to +125°C (Extended) *
Package
MG
= Plastic Quad Flat, No Lead Package
(3x3x0.9 mm Body), 16-Lead
P
= Plastic DIP (300 mil Body), 18-Lead
SO
= Plastic SOIC (300 mil Body), 18-Lead
SS
= Plastic SSOP (5.3 mm), 20-Lead
PART NO.
X
/XX
Package
Temperature
Range
Device
Examples:
a)
MCP23009-E/P:
Extended Temp.,
18LD PDIP package.
b)
MCP23009-E/SO:
Extended Temp.,
18LD SOIC package.
c)
MCP23009T-E/SO: Tape and Reel,
Extended Temp.,
18LD SOIC package.
d)
MCP23009-E/SS:
Extended Temp.,
20LD SSOP package.
e)
MCP23009T-E/SS: Tape and Reel,
Extended Temp.,
20LD SSOP package.
f)
MCP23009-E/MG: Extended Temp.,
16LD QFN package.
a)
MCP23S09-E/P:
Extended Temp.,
18LD PDIP package.
b)
MCP23S09-E/SO:
Extended Temp.,
18LD SOIC package.
c)
MCP23S09T-E/SO: Tape and Reel,
Extended Temp.,
18LD SOIC package.
d)
MCP23S09T-E/MG: Tape and Reel,
Extended Temp.,
16LD QFN package.
相關(guān)PDF資料
PDF描述
MCP23009-E/P IC I/O EXPANDER I2C 8B 18DIP
MCP23009-E/SS IC I/O EXPANDER I2C 8B 20SSOP
MCP23009-E/SO IC I/O EXPANDER I2C 8B 18SOIC
MCP23008-E/P IC I/O EXPANDER I2C 8B 18DIP
ATMEGA48PA-ANR MCU AVR 4KB FLASH 20MHZ 32TQFP
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