參數(shù)資料
型號: MCP23S18-E/SP
廠商: Microchip Technology
文件頁數(shù): 49/56頁
文件大小: 0K
描述: IC EXPANDER SPI 16BIT I/O 28SDIP
標(biāo)準(zhǔn)包裝: 15
接口: SPI
輸入/輸出數(shù): 16
中斷輸出:
頻率 - 時鐘: 10MHz
電源電壓: 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 通孔
封裝/外殼: 28-DIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 28-DIP
包裝: 管件
產(chǎn)品目錄頁面: 684 (CN2011-ZH PDF)
2008 Microchip Technology Inc.
DS22103A-page 53
MCP23018/MCP23S18
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
.
Device
MCP23018:
16-Bit I/O Expander w/ I2C Inter-
face
MCP23018T:
16-Bit I/O Expander w/ I2C Interface
(Tape and Reel)
MCP23S18:
16-Bit I/O Expander w/ SPI Interface
MCP23S18T:
16-Bit I/O Expander w/ SPI Interface
(Tape and Reel)
Temperature
Range
E= -40
°C to +125°C (Extended) *
Package
MJ
= Plastic Quad Flat, No Lead Package
(4x4x0.9 mm Body), 24-Lead
SP
= Skinny Plastic DIP (300 mil Body), 28-Lead
SO
= Plastic SOIC (300 mil Body), 28-Lead
SS
= SSOP, (209 mil Body, 5.30 mm), 24-Lead
PART NO.
X
/XX
Package
Temperature
Range
Device
Examples:
a)
MCP23018-E/SP:
Extended Temp.,
28LD SPDIP package.
b)
MCP23018-E/SO:
Extended Temp.,
28LD SOIC package.
c)
MCP23018T-E/SO: Tape and Reel,
Extended Temp.,
28LD SOIC package.
d)
MCP23018-E/SS:
Extended Temp.,
24LD SSOP package.
e)
MCP23018T-E/SS: Tape and Reel,
Extended Temp.,
24LD SSOP package.
f)
MCP23018-E/MJ:
Extended Temp.,
24LD QFN package.
a)
MCP23S18-E/SP:
Extended Temp.,
28LD SPDIP package.
b)
MCP23S18-E/SO:
Extended Temp.,
28LD SOIC package.
c)
MCP23S18T-E/SO: Tape and Reel,
Extended Temp.,
28LD SOIC package.
d)
MCP23S18T-E/MJ: Tape and Reel,
Extended Temp.,
24LD QFN package.
相關(guān)PDF資料
PDF描述
MCP23S18-E/SO IC I/O EXPANDER SPI 16B 28SOIC
MCP23016-I/SP IC I/O EXPANDER I2C 16B 28SDIP
MCP23018-E/MJ IC I/O EXPANDER I2C 16B 24QFN
MCP23009-E/MG IC I/O EXPANDER I2C 8B 16QFN
MCP23018-E/SO IC I/O EXPANDER I2C 16B 28SOIC
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MCP23S18T-E/MJ 功能描述:接口-I/O擴(kuò)展器 16B I/O Expander SPI interface RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
MCP23S18T-E/SO 功能描述:接口-I/O擴(kuò)展器 16B I/O Expander SPI interface RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
MCP23S18T-E/SP 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:16-Bit I/O Expander with Open-Drain Outputs
MCP23S18T-E/SS 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:16-Bit I/O Expander with Open-Drain Outputs