參數(shù)資料
型號: MCP4012T-503E/CH
廠商: Microchip Technology
文件頁數(shù): 49/54頁
文件大小: 0K
描述: IC DGTL POT 50K 1CH RHEO SOT23-6
標(biāo)準(zhǔn)包裝: 1
接片: 64
電阻(歐姆): 50k
電路數(shù): 1
溫度系數(shù): 標(biāo)準(zhǔn)值 150 ppm/°C
存儲器類型: 易失
接口: 2 線串行(芯片選擇,增/減)
電源電壓: 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: SOT-23-6
供應(yīng)商設(shè)備封裝: SOT-23-6
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁面: 674 (CN2011-ZH PDF)
其它名稱: MCP4012T-503E/CHDKR
2006 Microchip Technology Inc.
DS21978C-page 53
MCP4011/2/3/4
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
L
L1
c
A2
A1
A
b
2
1
NOTE 1
e
E
E1
D
N
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Units
Dimension Limits
N
e
A
A2
A1
E
E1
D
L
L1
c
b
0.75
0.00
0.40
0.08
0.22
8
0.65 BSC
0.85
4.90 BSC
3.00 BSC
0.60
0.95 REF
1.10
0.95
0.15
0.80
0.23
0.40
MIN
NOM
MAX
MILLIMETERS
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–111, Sept. 8, 2006
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