參數(shù)資料
型號(hào)： MCP451S
廠商： Microchip Technology Inc.
英文描述： 400000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
中文描述： 13.56 MHz讀/寫無源RFID器件
文件頁數(shù)： 40/50頁
文件大小： 1172K
代理商： MCP451S
MCRF450/451/452/455
DS40232H-page 40
2003 Microchip Technology Inc.
10.0
FAILED DIE IDENTIFICATION
Every die on the wafer is electrically tested according
to the data sheet specifications and visually inspected
to detect any mechanical damage, such as mechanical
cracks and scratches.
Any failed die in the test or visual inspection is identified
by black colored ink. Therefore, any die covered with
black ink should not be used.
The ink dot specification:
Ink dot size: 254
μ
m in circular diameter
Position: central third of die
Color: black
11.0
WAFER DELIVERY
DOCUMENTATION
The wafer is shipped with the following information:
Microchip Technology Inc. MP Code
Lot Number
Total number of wafers in the container
Total number of good dice in the container
Average die per wafer (DPW)
Scribe number of wafers with number of good
dice
12.0
NOTICE ON DIE AND WAFER
HANDLING
The device is very susceptible to Electrostatic
Discharge (ESD), which can cause a critical damage to
the device. Special attention is needed during the
handling process.
Any ultraviolet (UV) light can erase the memory cell
contents of an unpackaged device. Fluorescent lights
and sunlight can also erase the memory cell, although
it takes more time than UV lamps. Therefore, keep any
unpackaged device out of UV light and also avoid direct
exposure of strong fluorescent lights and shining
sunlight.
Certain IC manufacturing, COB, and tag assembly
operations may use UV light. Operations such as back-
grind de-tape, certain cleaning procedures, epoxy or
glue cure should be done without exposing the die
surface to UV light.
Using X-ray for die inspection will not harm the die, nor
erase memory cell contents.
13.0
REFERENCES
It is recommended that the reader reference the
following documents.
1.
“
Antenna Circuit Design for RFID Applications
”,
AN710, DS00710.
2.
“
RFID Tag and COB Development Guide with
Microchip’s RFID Devices
”, AN830, DS00830.
3.
“
CRC Algorithm for MCRF45X Read/Write
Devices
”, AN752, DS00752.
4.
“
Interface Control Document for 13.56 MHz
Anti-collision Interrogator
”, AN759, DS00759.
5.
“
13.56 MHz Reader Reference Design for the
MCRF450/451/452/455 Read/Write Devices
”,
DS21654.
相關(guān)PDF資料
PDF描述
MCP451SB 13.56 MHz Read/Write Passive RFID Device
MCP451SN 13.56 MHz Read/Write Passive RFID Device
MCP451W 400000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
MCP451WB 400000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
MCP451WF 400000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
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