參數(shù)資料
型號： MCP451SB
廠商： Microchip Technology Inc.
英文描述： 13.56 MHz Read/Write Passive RFID Device
中文描述： 13.56 MHz讀/寫無源RFID器件
文件頁數(shù)： 47/50頁
文件大?。?/td> 1172K
代理商： MCP451SB
2003 Microchip Technology Inc.
DS40232H-page47
MCRF450/451/452/455
PRODUCT IDENTIFICATION SYSTEM
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Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
Your local Microchip sales office
2.
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3.
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Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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PART NO.
X
/XX
Package
Temperature
Range
Device
Device:
MCRF450:
13.56 MHz Anti-collision Read/Write
MicroID device w/no internal resonant
capacitor
MCRF450/7M:
COB (Chip-On-Board) module with dual
68 pF capacitor
MCRF451:
13.56 MHz Anti-collision Read/Write
MicroID device w/100 pF internal
resonant capacitor
MCRF452:
13.56 MHz Anti-collision Read/Write
MicroID device w/25 pF internal resonant
capacitor
MCRF455:
13.56 MHz Anti-collision Read/Write
MicroID device w/50 pF internal resonant
capacitor
Temperature Range:
= -20
°
C to +70
°
C
Package:
WF
= Sawed 8" wafer on frame (8 mil backgrind)
WFB
= Bumped, sawed 8" wafer on frame (8 mil
backgrind
W
= 8" wafer (11 mil backgrind)
WB
= Bumped 8" wafer (8 mil backgrind)
S
= Dice in waffle pack (8 mil backgrind)
SB
= Bumped die in waffle pack (8 mil backgrind)
X/SN
= SOIC (150 mil body), 8-lead (rotated pinout)
P
= PDIP (300 mil body), 8-lead
Examples:
a)
MCRF450/W:
13.56 MHz Anti-collision
Read/Write MicroID device, 1 Kbit, no cap, 8"
wafer, 11-mil backgrind.
b)
MCRF450/7M:
13.56 MHz Anti-collision
Read/Write MicroID COB (IST IOA2), 1 Kbit,
68 pF dual capacitor between antenna A and B,
antenna B and V
SS
. Thickness = 0.4 mm.
c)
MCRF451/WF:
13.56 MHz Anti-collision
Read/Write MicroID device, 1 Kbit, 100 pF
internal res cap, 8" wafer on frame, 8 mil
backgrind.
d)
MCRF451/S:
13.56 MHz Anti-collision
Read/Write MicroID device in waffle pack,
1 Kbit, 100 pF internal res cap, 8-mil
thickness.
e)
MCRF452/WFB:13.56 MHz Anti-collision
Read/Write MicroID bumped device for flip-
chip assembly, 1 Kbit, 50 pF dual (25 pF)
internal res cap, Bumped 8" wafer, 8-mil
backgrind wafer on frame.
f)
MCRF455X/SN: 13.56 MHz Anti-collision
Read/Write MicroID device in SOIC package,
1k bit, 50 pF internal res cap.
相關PDF資料
PDF描述
MCP451SN 13.56 MHz Read/Write Passive RFID Device
MCP451W 400000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
MCP451WB 400000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
MCP451WF 400000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
MCP451X 400000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
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