參數(shù)資料
型號(hào): MCP6031
廠商: Microchip Technology Inc.
英文描述: 0.9 uA, High Precision Op Amps
中文描述: 0.9微安,高精度運(yùn)算放大器
文件頁(yè)數(shù): 21/30頁(yè)
文件大小: 870K
代理商: MCP6031
2007 Microchip Technology Inc.
DS22041A-page 21
MCP6031/2/3/4
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
NOM
8
0.65 BSC
0.85
4.90 BSC
3.00 BSC
3.00 BSC
0.60
0.95 REF
Dimension Limits
MIN
MAX
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
e
A
A2
A1
E
E1
D
L
L1
φ
c
b
1.10
0.95
0.15
0.75
0.00
0.40
0.80
0.08
0.22
0.23
0.40
D
N
E
E1
NOTE 1
1
2
e
b
A
A1
A2
c
L1
L
φ
Microchip Technology Drawing C04-111B
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