參數(shù)資料
型號(hào): MCP664-E/ST
廠商: Microchip Technology
文件頁(yè)數(shù): 60/68頁(yè)
文件大?。?/td> 0K
描述: IC OPAMP QUAD 6MA 60MHZ 14TSSOP
標(biāo)準(zhǔn)包裝: 96
放大器類型: 通用
電路數(shù): 4
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 32 V/µs
增益帶寬積: 60MHz
電流 - 輸入偏壓: 6pA
電壓 - 輸入偏移: 1800µV
電流 - 電源: 6mA
電流 - 輸出 / 通道: 80mA
電壓 - 電源,單路/雙路(±): 2.5 V ~ 5.5 V,±1.25 V ~ 2.75 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 14-TSSOP
包裝: 管件
2009-2012 Microchip Technology Inc.
DS22194D-page 63
MCP660/1/2/3/4/5/9
APPENDIX A: REVISION HISTORY
Revision D (March 2012)
The following is the list of modifications:
Added the MSOP (8L) package for MCP662 and
all related information throughout the document.
Revision C (November 2011)
The following is the list of modifications:
1.
Added the SOT-23 (5L) and TDFN (8L) package
option for MCP661 and SOT-23 (6L) package
options for MCP663 and the related information
throughout the document. Updated Package
Types drawing with pin designation for each
new package.
2.
Updated Table 1-4 to show the temperature
specifications for new packages.
3.
Updated Table 3-1 to show all the pin functions.
4.
tion” with markings for the new additions.
Added the corresponding SOT-23 (5L and 6L)
and 2x3 TDFN (8L) package options and related
information.
5.
Updated table description and examples in the
Revision B (September 2011)
The following is the list of modifications:
1.
Added the MCP660, MCP664 and MCP669
amplifiers to the product family and the related
information throughout the document.
2.
Added the 4x4 QFN (16L) package option for
MCP660 and MCP669, SOIC and TSSOP (14L)
package options for MCP660 and MCP665 and
the
related
information
throughout
the
document. Updated Package Types drawing
with pin designation for each new package.
3.
Updated Table 1-4 to show the temperature
specifications for new packages.
4.
Updated Table 3-1 to show all the pin functions.
5.
tion” with markings for the new additions.
Added the corresponding SOIC and TSSOP
(14L), and 4x4 QFN (16L) package options and
related information.
6.
Updated table description and examples in
Revision A (July 2009)
Original release of this document.
相關(guān)PDF資料
PDF描述
324471 CONN SPLICE BUTT 1000MCM AMPOWER
MCP664-E/SL IC OPAMP QUAD 6MA 60MHZ 14SOIC
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCP664T-E/SL 功能描述:運(yùn)算放大器 - 運(yùn)放 Quad 60MHz OP E temp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MCP664T-E/ST 功能描述:運(yùn)算放大器 - 運(yùn)放 Quad 60MHz OP E temp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MCP665-E/MF 功能描述:運(yùn)算放大器 - 運(yùn)放 Dual 60MHz OP w /CS E temp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MCP665-E/UN 功能描述:運(yùn)算放大器 - 運(yùn)放 Dual 60MHz OP w /CS E temp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MCP665T-E/MF 功能描述:運(yùn)算放大器 - 運(yùn)放 Dual 60MHz OP w /CS E temp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel