參數(shù)資料
型號: MCP6V28-E/MS
廠商: Microchip Technology
文件頁數(shù): 1/50頁
文件大?。?/td> 0K
描述: IC OPAMP AUTO-ZERO SGL 8MSOP
標(biāo)準(zhǔn)包裝: 100
放大器類型: 自動調(diào)零
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 1 V/µs
增益帶寬積: 2MHz
電流 - 輸入偏壓: 7pA
電壓 - 輸入偏移: 2µV
電流 - 電源: 620µA
電流 - 輸出 / 通道: 22mA
電壓 - 電源,單路/雙路(±): 2.3 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 8-MSOP
包裝: 管件
2011 Microchip Technology Inc.
DS25007B-page 1
MCP6V26/7/8
Features
High DC Precision:
-VOS Drift: ±50 nV/°C (maximum)
-VOS: ±2 V (maximum)
-AOL: 125 dB (minimum)
- PSRR: 125 dB (minimum)
- CMRR: 120 dB (minimum)
-Eni: 1.0 VP-P (typical), f = 0.1 Hz to 10 Hz
-Eni: 0.32 VP-P (typical), f = 0.01 Hz to 1 Hz
Low Power and Supply Voltages:
-IQ: 620 A/amplifier (typical)
- Wide Supply Voltage Range: 2.3V to 5.5V
Easy to Use:
- Rail-to-Rail Input/Output
- Gain Bandwidth Product: 2 MHz (typical)
- Unity Gain Stable
- Available in Single and Dual
- Single with Chip Select (CS): MCP6V28
Extended Temperature Range: -40°C to +125°C
Typical Applications
Portable Instrumentation
Sensor Conditioning
Temperature Measurement
DC Offset Correction
Medical Instrumentation
Design Aids
SPICE Macro Models
FilterLab Software
Microchip Advanced Part Selector (MAPS)
Analog Demonstration and Evaluation Boards
Application Notes
Related Parts
Parts with lower power, lower bandwidth and higher
noise:
MCP6V01/2/3: Spread clock
MCP6V06/7/8: Non-spread clock
Description
The Microchip Technology Inc. MCP6V26/7/8 family of
operational amplifiers provides input offset voltage
correction for very low offset and offset drift. These
devices have a wide gain bandwidth product (2 MHz,
typical) and strongly reject switching noise. They are
unity gain stable, have no 1/f noise, and have good
power supply rejection ratio (PSRR) and common
mode rejection ratio (CMRR). These products operate
with a single supply voltage as low as 2.3V, while
drawing 620 A/amplifier (typical) of quiescent current.
The Microchip Technology Inc. MCP6V26/7/8 op amps
are offered as a single (MCP6V26), single with Chip
Select (CS) (MCP6V28) and dual (MCP6V27). They
were designed using an advanced CMOS process.
Package Types (top view)
VIN+
VIN
VSS
VDD
VOUT
1
2
3
4
8
7
6
5 NC
NC
VINA+
VINA
VSS
1
2
3
4
8
7
6
5
VOUTA
VDD
VOUTB
VINB
VINB+
MCP6V26
MSOP, SOIC
MCP6V27
MSOP, SOIC
VIN+
VIN
VSS
VDD
VOUT
1
2
3
4
8
7
6
5 NC
CS
NC
MCP6V28
MSOP, SOIC
VINA+
VINA
VSS
1
2
3
4
8
7
6
5
VOUTA
VDD
VOUTB
VINB
VINB+
MCP6V27
4×4 DFN *
* Includes Exposed Thermal Pad (EP); see Table 3-1.
EP
9
VIN+
VIN
VSS
1
2
3
4
8
7
6
5
NC
VDD
VOUT
NC
MCP6V26
2×3 TDFN *
EP
9
VIN+
VIN
VSS
1
2
3
4
8
7
6
5
NC
CS
VDD
VOUT
NC
MCP6V28
2×3 TDFN *
EP
9
620 A, 2 MHz Auto-Zeroed Op Amps
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