參數(shù)資料
型號： MCP73213T-A6SI/MF
廠商： Microchip Technology
文件頁數(shù)： 18/36頁
文件大?。?/td> 0K
描述： IC LI-ION/LI-POLY CTRLR 10-DFN
標準包裝： 3,300
功能： 充電管理
電池化學： 鋰離子（Li-Ion）、鋰聚合物（Li-Pol）
電源電壓： 4 V ~ 16 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 10-VFDFN 裸露焊盤
供應商設(shè)備封裝： 10-DFN-EP（3x3）
包裝： 帶卷 (TR)
配用： MCP73213EV-2SOVP-ND - BOARD EVAL BATT CHARGER MCP73213
25
Analog & Interface Product Selector Guide Summer 2012
In
Ter
Fa
ce
:
s
erial
P
eripherals
P
ar
t#
d
escription
o
perating
Voltage
(V)
o
perating T
emp.
r
ange
(°
c
)
Bus Type
m
ax.
Bus
Frequency
(k
h
z)
Features
P
ackages
MCP23008
8-bit
I/O
P
or
tExpander
1.8
to
5.5
40
to
+85
I2
C
1700
3
HW
address
pins,
HW
interrupt,
25
mA
source/sink
capability
per
I/O
18-pin
PDIP,
18-pin
SOIC,
20-pin
SSOP,
20-pin
4×4
QFN
MCP23S08
8-bit
I/O
P
or
tExpander
1.8
to
5.5
40
to
+85
SPI
10000
2
HW
address
pins,
HW
interrupt,
25
mA
source/sink
capability
per
I/O
18-pin
PDIP,
18-pin
SOIC,
20-pin
SSOP,
20-pin
4×4
QFN
MCP23009
8-bit
I/O
P
or
tExpander
1.8
to
5.5
40
to
+125
I2
C
3400
1
HW
address
pin,
HW
interrupt,
25
mA
source/sink
per
I/O,
100
kHz,
400
kHz
and
3.4
MHz
I
2 C
supported
18-pin
PDIP,
18-pin
SOIC,
20-pin
SSOP
MCP23S09
8-bit
I/O
P
or
tExpander
1.8
to
5.5
40
to
+125
SPI
10000
HW
interrupt,
25
mA
source/sink
per
I/O
18-pin
PDIP,
18-pin
SOIC
MCP23016
16-bit
I/O
P
or
tExpander
2.0
to
5.5
40
to
+85
I2
C
400
3
HW
address
inputs,
HW
interrupt,
25
mA
source/sink
capability
per
I/O
28-pin
PDIP,
28-pin
SOIC,
28-pin
SSOP,
28-pin
6×6
QFN
MCP23017
16-bit
I/O
Expander
1.8
to
5.5
40
to
+125
I2
C
1700
3
HW
address
pins,
25
mA
sink/source
per
I/O,
100
kHz,
400
kHz
and
3-4
MHz
I
2 C
supported,
Interrupt
output
28-pin
PDIP,
28-pin
SOIC,
28-pin
SSOP,
28-pin
QFN
MCP23S17
16-bit
I/O
Expander
1.8
to
5.5
40
to
+125
SPI
10000
3
HW
address
pins,
25
mA
sink/source
per
I/O,
Interrupt
output
28-pin
PDIP,
28-pin
SOIC,
28-pin
SSOP,
28-pin
QFN
MCP23018
16-bit
I/O
P
or
tExpander
1.8
to
5.5
40
to
+125
I2
C
3400
1
HW
address
pin,
2
HW
interrupts,
25
mA
source/sink
per
I/O,
100
kHz,
400
kHz
and
3.4
MHz
I
2 C
supported
24-pin
SSOP,
28-pin
SOIC,
28-pin
SDIP
MCP23S18
16-bit
I/O
P
or
tExpander
1.8
to
5.5
40
to
+125
SPI
10000
2
HW
interrupts,
25
mA
source/sink
per
I/O
28-pin
SOIC,
28-pin
SDIP
INTERF
ACE:
IEEE
802.15.4
ZigBee
RF
T
ransceiver
Products
P
ar
t#
Frequency range
(
gh
z)
s
ensitivity (dBm)
P
ow
er
o
utput (dBm)
rss
I
TX
P
ow
er
c
onsumption
(m
a
)
r
XP
ow
er
c
onsumption
(m
a
)
c
lock
(mh
z)
s
leep
m
ac
ma
c
Features
encr
yption
Interface
Pin count
P
ackages
MRF24J40
2.405
to
2.48
95
0
Ye
s
18
22
20
Ye
s
Ye
s
CSMA-CA
AES128
4-wire
SPI
40
40-pin
QFN
MRF24J40MA
2.405
to
2.48
95
0
Ye
s
23
19
20
Ye
s
Ye
s
CSMA-CA
AES128
4-wire
SPI
12
Module
MRF24J40MB
2.405
to
2.48
102
20
Ye
s
120
25
20
Ye
s
Ye
s
CSMA-CA
AES128
4-wire
SPI
12
Module
MRF49XA
433/868/915
110
7
Ye
s
15
11
–
Ye
s
–
4-wire
SPI
16
16-pin
TSSOP
In
Ter
Fa
ce
:
stand-alone
r
F
r
eceiver
Products
P
ar
t#
m
odulation
d
ata
r
ate
(kbps)
Frequency
r
ange
(
mh
z)
s
ensitivity
(dBm)
IF
F
requency
r
ange
(mh
z)
o
perating
V
oltage
(V)
rss
I
s
electable
lna
g
ain
P
ackages
rfRXD0420
ASK,
FSK,
FM
80
300
to
450
111
0.455
to
21.4
2.5
to
5.5
Ye
s
Ye
s
32-pin
LQFP
rfRXD0920
ASK,
FSK,
FM
80
800
to
930
109
0.455
to
21.4
2.5
to
5.5
Ye
s
Ye
s
32-pin
LQFP
In
Ter
Fa
ce
:
us
B
Products
P
ar
t#
us
B
s
peed
us
B
c
ompliant
P
hy
mcu
Interface
Tx
/r
xBuff
er
s
ize
(b
ytes)
n
umber
of
g
PI
o
perating
V
oltage
(V)
P
ackages
MCP2200
Full-Speed
USB
(12
Mb/s),
Low-Speed
USB
(1.5
Mb/s)
Ye
s
Ye
s
UART
128/128
8
2.7
to
5.5
20-pin
SOIC,
20-pin
TSSOP,
20-pin
QFN
MCP2210
Full-Speed
USB
(12
Mb/s),
Low-Speed
USB
(1.5
Mb/s)
Ye
s
Ye
s
SPI
64
9
3.3
to
5.5
20-pin
SOIC,
20-pin
TSSOP,
20-pin
QFN
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