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參數(shù)資料
| 型號： | MCP73842 |
| 廠商： | Microchip Technology Inc. |
| 元件分類： | FPGA |
| 英文描述： | FPGA - 200000 SYSTEM GATE 2.5 VOLT - NOT RECOMMENDED for NEW DESIGN |
| 中文描述： | 先進的單節(jié)或雙節(jié)鋰離子/鋰聚合物充電管理控制器 |
| 文件頁數(shù)： | 20/24頁 |
| 文件大?。?/td> | 414K |
| 代理商： | MCP73842 |
MCP73841/2/3/4
DS21823B-page 20
2004 Microchip Technology Inc.
10-Lead Plastic Micro Small Outline Package (UN) (MSOP)
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
.037 REF
F
φ
Footprint
Foot Angle
Lead Thickness
Notes:
Drawing No. C04-021
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Lead Width
β
α
c
B
.003
.006
-
.009
Dimension Limits
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Number of Pins
Pitch
A
A2
L
E1
D
A1
E
.016
.024
.118 BSC
.118 BSC
.000
.030
.193 BSC
.033
MIN
p
n
Units
.020 TYP
NOM
10
INCHES
0.95 REF
-
0.23
.009
.012
15°
0.08
0.15
-
-
0.23
0.30
15°
15°
MILLIMETERS*
NOM
0.50 TYP.
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.037
.006
.031
0.40
0.00
0.75
MIN
MAX
1.10
0.95
0.80
0.15
MAX
10
5°
5°
-
-
-
0°
-
8°
5°
-
5°
-
15°
JEDEC Equivalent: MO-187
8°
0°
E
L
D
β
(F)
B
p
E1
n
φ
α
A2
1
2
c
A1
A
L1
-
-
-
-
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