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參數(shù)資料
| 型號： | MCRF355 |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | CONNECTEUR |
| 中文描述： | 13.56 MHz無源RFID器件的防沖突功能 |
| 文件頁數(shù)： | 19/23頁 |
| 文件大?。?/td> | 568K |
| 代理商： | MCRF355 |
2002 Microchip Technology Inc.
DS21287F-page 19
MCRF355/360
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
Device:
MCRF355
MCRF355/6C
= 13.56 MHz Anti-Collision device.
= MCRF355 Cross Technology World II
COB module with dual 68 pF
capacitors
= MCRF355 IST I0A2 COB module with
dual 68 pF capacitors
= MCRF355 COB module with dual
68 pF capacitors.
= 13.56 MHz Anti-Collision device with
100 pF on-chip resonance capacitor.
MCRF355/7M
MCRF355/7M:
MCRF360
Temperature Range:
= -20°C to +70°C
Package:
W
WB
WF
WFB
= Wafer (11 mil backgrind)
= Bumped wafer (8 mil backgrind)
= Sawed wafer on frame (8 mil backgrind)
= Bumped, sawed wafer on frame
(8 mil backgrind)
= Plastic PDIP (300 mil Body) 8-lead
= Dice in waffle pack (8 mil)
= Bumped die in waffle pack (8 mil)
= Plastic SOIC (150 mil Body) 8-lead
P
S
SB
SN
PART NO.
X
/XXX
Package
Temperature
Range
Device
Examples:
a)
MCRF355/W:
= 11-mil wafer.
b)
MCRF355/WF: = 8-mil wafer on frame.
c)
MCRF355/P:
= PDIP package.
a)
MCRF360/WFB:= Bumped 8-mil wafer on
frame
b)
MCRF360/SB: = Bumped 8-mil die.
c)
MCRF360/SN: = SOIC package.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MCRF360 | CONNECTOR |
| MCT62H | Dual Channel Optocoupler with Phototransistor |
| MDC3105 | Integrated Relay, Inductive Load Driver(電感負載/延遲驅(qū)動器) |
| MDF27A-1822P | Crimping Contact Directly Mounted on Board |
| MDF12-1822PC | Crimping Contact Directly Mounted on Board |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCRF360 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Passive RFID Device with Anti-Collision Feature |
| MCRF450 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Read/Write Passive RFID Device |
| MCRF451 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Read/Write Passive RFID Device |
| MCRF452 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Read/Write Passive RFID Device |
| MCRF455 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Read/Write Passive RFID Device |
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