MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS
參數(shù)資料
型號(hào)： MCZ33661EFR2
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 17/22頁(yè)
文件大?。?/td> 0K
描述： IC LIN INTERFACE PHYSICAL 8-SOIC
標(biāo)準(zhǔn)包裝： 2,500
系列： *
應(yīng)用： *
接口： *
電源電壓： *
封裝/外殼： 8-SOIC（0.154"，3.90mm 寬）
供應(yīng)商設(shè)備封裝： 8-SOICN
包裝： 帶卷 (TR)
安裝類型： 表面貼裝
Analog Integrated Circuit Device Data
4
Freescale Semiconductor
33661
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Power Supply Voltage
Continuous Supply Voltage
Transient Voltage (Load Dump)
VSUP
27
40
V
WAKE DC and Transient Voltage (Through a 33 k
Serial Resistor)
VWAKE
-18 to 40
V
Logic Voltage (RXD, TXD, EN Pins)
VLOG
-0.3 to 5.5
V
LIN Bus Voltage
DC Voltage
Transient (Coupled Through 1.0 nF Capacitor)
VBUS
-18 to 40
-150 to 100
V
INH Voltage/Current
DC Voltage
DC Current
VINH
IINH
-0.3 to VSUP + 0.3
40
V
mA
ESD Voltage (1)
Human Body Model
All Pins
LIN Pin with Respect to Ground
Machine Model
VESD1
VESD2
±2000
±5000
±200
V
THERMAL RATINGS
Operating Temperature
Ambient
Junction
TA
TJ
-40 to 125
-40 to 150
C
Storage Temperature
TSTG
-55 to 150
C
Thermal Resistance, Junction to Ambient
RJA
150
°C/W
Peak Package Reflow Temperature During Reflow (2), (3)
TPPRT
°C
Thermal Shutdown Temperature
TSHUT
150 to 200
°C
Thermal Shutdown Hysteresis Temperature
THYST
8.0 to 20
°C
Notes
1.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 220 pF, RZAP = 0 ).
2.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3.
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