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參數(shù)資料
| 型號： | MCZ33884EGR2 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 17/21頁 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLE CONTACT MON 24-SOIC |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 系列： | * |
| 應(yīng)用： | * |
| 接口： | * |
| 電源電壓： | * |
| 封裝/外殼： | 24-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-SOIC |
| 包裝： | 帶卷 (TR) |
| 安裝類型： | 表面貼裝 |
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33884
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Power Supply Voltage
CS, SI, SO, SCLK, RST, MASL, SYNC, INT (1)
VDD
-0.3 to 7.0
VDC
VPWR Supply Voltage
VPWR
-16 to 50
VDC
Switch Input Voltage Range
VSI
-14 to 40
VDC
Recommended Frequency of SPI Operation
fSPI
3.0
MHz
ESD Voltage (2)
Human Body Model (3) (4)
Machine Model (3) (5)
V
VESD2
4000
200
V
Storage Temperature
TSTG
-55 to 150
°C
Operating Case Temperature
TC
-40 to 105
°C
Operating Junction Temperature
TJ
-40 to 150
°C
TPPRT
°C
Thermal Resistance (Junction-to-Ambient)
P
θ
J-A
107
°C/W
Notes
1
Exceeding these limits may cause malfunction or permanent damage to the device.
2
ESD data available upon request.
3
ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 ) and ESD2 testing is performed
in accordance with the Machine Model (CZAP=200 pF, RZAP=0 ).
4
All pins are tested individually.
5
1 kV on VPWR and VDD when connected together. See page three.
6
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
7.
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