THERMAL ADDENDUM (REV 2.0) ADDITIONAL DOCUMENT" />
參數(shù)資料
型號(hào)： MCZ33889DEG
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 51/59頁(yè)
文件大小： 0K
描述： IC SYSTEM BASIS W/CAN 28-SOIC
標(biāo)準(zhǔn)包裝： 26
系列： *
應(yīng)用： *
接口： *
電源電壓： *
封裝/外殼： 28-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 28-SOIC W
包裝： 管件
安裝類型： 表面貼裝
Analog Integrated Circuit Device Data
Freescale Semiconductor
55
33889
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33889 technical
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
Packaging and Thermal Considerations
The MC33889 is offered in a 28 pin SOICW, single die package. There is a
single heat source (P), a single junction temperature (TJ), and thermal resistance
(RJA).
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
Figure 25. Surface Mount for SOIC Wide Body
Non-Exposed Pad
28-PIN
SOICW
EG SUFFIX (PB-FREE)
98ASB42345
28-PIN SOICW
NOTE FOR PACKAGE DIMENSIONS,
REFER TO THE 33889 DEVICE DATASHEET.
33889EG
TJ
=
RJA
.
P
Table 31. Thermal Performance Comparison
Thermal Resistance
[
C/W]
42
11
69
23
Notes
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2.
2s2p thermal test board per JEDEC JESD51-7.
3.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
4.
Single layer thermal test board per JEDEC JESD51-3.
5.
Thermal resistance between the die junction and the
package top surface; cold plate attached to the package top
surface and remaining surfaces insulated.
20 Terminal SOICW
1.27 mm Pitch
18.0 mm x 7.5 mm Body
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