參數(shù)資料
型號: MF0ICU1701NDUD
廠商: NXP Semiconductors N.V.
元件分類: 外設(shè)及接口
英文描述: NFC Forum Type 2 Tag compliant IC with 144 bytes user memory
文件頁數(shù): 3/10頁
文件大?。?/td> 82K
代理商: MF0ICU1701NDUD
NTAG203_SDS
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.0 — 19 October 2011
218630
3 of 10
NXP Semiconductors
NTAG203
NFC Forum Type 2 Tag compliant IC with 144 bytes user memory
2.5 Cascaded UID
The anticollision function is based on an IC individual serial number called Unique
IDentifier. The UID of the NTAG203 is 7 bytes long and supports cascade level 2
according to ISO/IEC 14443-3.
2.6 Anticollision
An intelligent anticollision function according to ISO/IEC 14443 allows to operate more
than one card in the field simultaneously. The anticollision algorithm selects each card
individually and ensures that the execution of a transaction with a selected card is
performed correctly without data corruption resulting from other cards in the field.
3. Quick reference data
[1]
Stresses above one or more of the limiting values may cause permanent damage to the device.
[2]
These are stress ratings only. Operation of the device at these or any other conditions above those given in the Characteristics section
of the specification is not implied.
[3]
Exposure to limiting values for extended periods may affect device reliability.
[4]
LCR meter HP 4285, T
amb
= 22
C, Cp-D, f
i
= 13.56 MHz, 2Veff.
4. Ordering information
Table 3.
Type number
Table 2.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1][2][3]
Symbol
Parameter
f
i
input frequency
C
i
input capacitance
Quick reference data
Conditions
Min
-
44
Typ
13.56
50
Max
-
56
Unit
MHz
pF
50 pF version (bare silicon
and HWSON8)
[4]
EEPROM characteristics
t
cy(W)
t
ret
N
endu(W)
write cycle time
retention time
-
5
4.1
-
-
-
ms
year
T
amb
= 22
C
T
amb
= 22
C
write endurance
10000
-
-
cycle
Ordering information
Package
Name
wafer
Description
8 inch wafer (sawn, laser diced; 120
m thickness,
on film frame carrier; electronic fail die marking
according to SECSII format)
Version
-
MF0ICU1701NDUD
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