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參數(shù)資料
| 型號： | MF1PLUS6001DUD |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | Mainstream contactless smart card IC for fast and easy solution development |
| 文件頁數(shù)： | 5/20頁 |
| 文件大?。?/td> | 154K |
| 代理商： | MF1PLUS6001DUD |
MF1PLUSX0Y1_SDS
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 21 February 2011
163532
5 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
7. Pinning information
7.1 Smart card contactless module
Table 3.
Contactless interface module
Antenna contacts
LA
LB
Fig 2.
Contact assignments for SOT500-2 (MOA4)
Bonding pad assignments to smart card contactless module
MF1PLUSx0y1DA4/03 and /13
Symbol
Description
LA
antenna coil connection LA
LB
antenna coil connection LB
001aaj820
LA
LB
top view
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MF1PLUS6001DUD/02, | 功能描述:RFID應(yīng)答器 MF1PLUS6001DUD/UNCASED/FOIL//0 RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF1PLUS6001DUD/03, | 功能描述:RFID應(yīng)答器 MIFARE CRYPTO1 AES 848Kbps 2KB RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF1PLUS6001DUD03 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development |
| MF1PLUS6011DA4/02 | 功能描述:IC SMART CARD 2KB EEPROM MOA4 RoHS:是 類別:RF/IF 和 RFID >> RFID IC 系列:MIFARE PLUS™ 其它有關(guān)文件:CR14 View All Specifications 標(biāo)準(zhǔn)包裝:1 系列:- RF 型:收發(fā)器 頻率:13.56MHz 特點(diǎn):ISO14443-B 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SO 包裝:Digi-Reel® 其它名稱:497-5719-6 |
| MF1PLUS6011DA4/02, | 功能描述:RFID應(yīng)答器 MIFARE PLUS X 2K SMART CARD RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
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