參數(shù)資料
型號(hào)： MF1PLUS8031DA4
廠商： NXP Semiconductors N.V.
元件分類： 外設(shè)及接口
英文描述： Mainstream contactless smart card IC for fast and easy solution development
文件頁(yè)數(shù)： 3/20頁(yè)
文件大小： 154K
代理商： MF1PLUS8031DA4
MF1PLUSX0Y1_SDS
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 21 February 2011
163532
3 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
5. Ordering information
Table 2.
Type number
Ordering information
Package
Commercial
name
FFC
Name
Description
Version
MF1PLUS8001DUD/03
-
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
4 kB EEPROM, 7-byte UID, L1 card
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
4 kB EEPROM, 4-byte UID, L1 card
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
4 kB EEPROM, 4-byte NUID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte NUID, L1 card
-
MF1PLUS8011DUD/03
FFC
-
-
MF1PLUS8031DUD/03
FFC
-
-
MF1PLUS8001DA4/03
MOA4
PLLMC
SOT500-2
MF1PLUS8011DA4/03
MOA4
PLLMC
SOT500-2
MF1PLUS8031DA4/03
MOA4
PLLMC
SOT500-2
MF1PLUS6001DUD/03
FFC
-
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
2 kB EEPROM, 7-byte UID, L1 card
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
2 kB EEPROM, 4-byte UID, L1 card
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
2 kB EEPROM, 4-byte NUID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte NUID, L1 card
8 inch wafer (sawn; 120 μm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
Ref. 3
,
4 kB EEPROM, 7-byte UID, no security level 1 or
2, L3 card
-
MF1PLUS6011DUD/03
FFC
-
-
MF1PLUS6031DUD/03
FFC
-
-
MF1PLUS6001DA4/03
MOA4
PLLMC
SOT500-2
MF1PLUS6011DA4/03
MOA4
PLLMC
SOT500-2
MF1PLUS6031DA4/03
MOA4
PLLMC
SOT500-2
MF1PLUS8001DUD/13
FFC
-
-
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MF1PLUS8031DA4/03, 功能描述:RFID應(yīng)答器 RFID MODULES DEV TOOLS RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1PLUS8031DA403 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development
MF1PLUS8031DUD/03, 功能描述:RFID應(yīng)答器 RFID MODULES & DEVELOPMENT TOOLS RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
MF1PLUS8031DUD03 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development
MF1PLUSX0Y1 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development
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