參數(shù)資料
型號: MF1S5037DUG
廠商: NXP Semiconductors N.V.
元件分類: 外設(shè)及接口
英文描述: MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development
封裝: MF1S5030DA3<SOT500|<<<1<Always Pb-free,;MF1S5030DA4<SOT500-2 (PLLMC)|<<http://www.nxp.com/packages/SOT500-2.html<1<Always Pb-free,;MF1S5030DA6<SOT500-3 (PLLMC)|&
文件頁數(shù): 30/37頁
文件大?。?/td> 425K
代理商: MF1S5037DUG
MF1S503x
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
PUBLIC
Rev. 3.1 — 21 February 2011
194031
30 of 37
NXP Semiconductors
MF1S503x
MIFARE Classic 1K - Mainstream contactless smart card IC
Fig 23. Bare die outline and chip orientation MF1S5037
001aan001
VSS
LA
TESTIO
LB
MF1S5037
Chip Step
Pad size
LA, LB, VSS
TESTIO
Bump size
LA, LB, VSS
TESTIO
90
75
90
90
x (
μ
m)
y (
μ
m)
104
89
104
104
1100
1030
86.4
Y
X
66.4
793.7
196.8
166.5
401.3
149.1
861.5
1100.0
Note
1. All dimensions in
μ
m, pad locations measured from outher sealring edge (see detail)
(1)
1030.0
799.4
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