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參數(shù)資料
| 型號： | MF1SPLUS8031DUD |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | Mainstream contactless smart card IC for fast and easy solution development |
| 文件頁數(shù)： | 3/17頁 |
| 文件大?。?/td> | 139K |
| 代理商： | MF1SPLUS8031DUD |
MF1SPLUSX0Y1_SDS
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 21 February 2011
187032
3 of 17
NXP Semiconductors
MF1SPLUSx0y1
Mainstream contactless smart card IC
5. Ordering information
Table 2.
Type number
Ordering information
Package
Commercial
Name
Name
Description
Version
MF1SPLUS8001DUD/03 FFC
-
8 inch wafer (sawn; 120 μm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
Ref. 3
, 4 kB EEPROM, 7-byte UID
8 inch wafer (sawn; 120 μm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
Ref. 3
, 4 kB EEPROM, 4-byte UID
8 inch wafer (sawn; 120 μm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 4K EEPROM, 4-byte NUID
plastic leadless module carrier package; 35 mm wide tape,
4 kB EEPROM, 7-byte UID
plastic leadless module carrier package; 35 mm wide tape,
4 kB EEPROM, 4-byte UID
plastic leadless module carrier package; 35 mm wide tape,
4K EEPROM, 4-byte NUID
8 inch wafer (sawn; 120 μm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
Ref. 3
, 2 kB EEPROM, 7-byte UID
8 inch wafer (sawn; 120 μm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
Ref. 3
, 2 kB EEPROM, 4-byte UID
8 inch wafer (sawn; 120 μm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 2K EEPROM, 4byte NUID
plastic leadless module carrier package; 35 mm wide tape,
2 kB EEPROM, 7-byte UID
plastic leadless module carrier package; 35 mm wide tape,
2 kB EEPROM, 4-byte UID
plastic leadless module carrier package; 35 mm wide tape,
2K EEPROM, 4-byte NUID
-
MF1SPLUS8011DUD/03
FFC
-
-
MF1SPLUS8031DUD/03 FFC
-
-
MF1SPLUS8001DA4/03
MOA4
PLLMC
SOT500-2
MF1SPLUS8011DA4/03
MOA4
PLLMC
SOT500-2
MF1SPLUS8031DA4/03
MOA4
PLLMC
SOT500-2
MF1SPLUS6001DUD/03 FFC
-
-
MF1SPLUS6011DUD/03
FFC
-
-
MF1SPLUS6031DUD/03 FFC
-
-
MF1SPLUS6001DA4/03
MOA4
PLLMC
SOT500-2
MF1SPLUS6011DA4/03
MOA4
PLLMC
SOT500-2
MF1SPLUS6031DA4/03
MOA4
PLLMC
SOT500-2
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MF1SPLUS8031DUD/03 | 功能描述:RFID應(yīng)答器 CONTACTLESS SMART CARD IC RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF1SPLUS8031DUD03 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development |
| MF1SPLUSX0Y1 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Mainstream contactless smart card IC for fast and easy solution development |
| MF1-X-00-416-5-GC2-1-C | 制造商:Carling Technologies 功能描述:M-SERIES CIRCUIT BREAKER - Bulk |
| MF1-X-00-466-8-GC2-B-C | 制造商:Carling Technologies 功能描述:M-SERIES CIRCUIT BREAKER - Bulk |
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