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參數(shù)資料
| 型號： | MF3ICDH8101DUD |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | MIFARE DESFire EV1 contactless multi-application IC |
| 文件頁數(shù)： | 6/18頁 |
| 文件大?。?/td> | 126K |
| 代理商： | MF3ICDH8101DUD |
MF3ICDX21_41_81_SDS
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.1 — 21 December 2010
145631
6 of 18
NXP Semiconductors
MF3ICDx21_41_81
MIFARE DESFire EV1 contactless multi-application IC
7. Limiting values
Table 3.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
I
I
input current
P
tot
/pack
total power dissipation per
package
T
stg
storage temperature
T
amb
ambient temperature
V
ESD
electrostatic discharge voltage
I
lu
latch-up current
[1]
Stresses above one or more of the limiting values may cause permanent damage to the device.
[2]
Exposure to limiting values for extended periods may affect device reliability.
[3]
MIL Standard 883-C method 3015; human body model: C = 100 pF, R = 1.5 k
.
Limiting values
[1][2]
Conditions
Min
-
-
Max
30
200
Unit
mA
mW
55
25
125
70
-
-
C
C
kV
mA
[3]
2
100
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MF3ICDH8101DUD/05, | 功能描述:RFID應(yīng)答器 MIFARE DESFIRE EV1 CONTACTLESS MULTIAPP RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF3MOD2101DA4/01,118 | 制造商:NXP Semiconductors 功能描述: |
| MF3MOD2101DA4/04,1 | 功能描述:RFID應(yīng)答器 MIFARE DESFire EV2 ContactlessMultiAppl RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF3MOD2101DA4/05,1 | 功能描述:RFID應(yīng)答器 MIFARE DESFire EV1 Contctless multi-app RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF3MOD2101DA4/051 | 制造商:NXP Semiconductors 功能描述:MIFARE DESFIRE 2K MOA4 |
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