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參數(shù)資料
| 型號： | MF70 |
| 廠商： | Dynex Semiconductor Ltd. |
| 英文描述： | Fast Recovery Diode |
| 中文描述： | 快速恢復二極管 |
| 文件頁數(shù)： | 8/8頁 |
| 文件大?。?/td> | 65K |
| 代理商： | MF70 |
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-
tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Tel: 011-800-5554-5554. Fax: 011-800-5444-5444Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Tel: 07351 827723